Lucent Technologies Inc.

Jonathan V Haggar

John S Rizzo

John E Boyd

Patrick J Drummond

John S Fangman

Stephanie C Marabella

A vacuum collet includes at least one weight disposed in the collet for assisting in removal of components from the collet. The weights are movable within the collet to gently dislodge components lodged on a bottom face of the collet. The weights may be actuated by the same vacuum which draws components to the collet.

Vacuum collet with release weights

A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Apparatus and method for chip processing

A vacuum collet includes a filament disposed in the collet for assisting in removal of components from the collet. The filament is movable in a vertical direction within the collet to gently dislodge components lodged on a bottom face of the collet. The filament may be actuated by a solenoid or pneumatic or hydraulic actuator.

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Fleetwood, PA, United States of America

Jonathan V Haggar