At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Infineon Technologies Ag

Jonathan Silvano De Sousa

Markus Leitgeb

Marco Gavagnin

Erich Schlaffer

Peter Irsigler

Thomas Grille

Gerald Weidinger

Ursula Hedenig

Gernot Grober

Bernhard Reitmaier

Johannes Stahr

Andreas Zluc

Thomas Christian Neidhart

Wolfgang Schrittwieser

Vijaye Rajaraman

Alexander Kasper

Ulrich Schmid

Mike Morianz

Heinz Moitzi

Thomas Krivec

Hannes Stahr

Bettina Schuster

Tobias Frischmuth

Gernot Schulz

Nick Renaud-Bezot

Hannes Voraberger

Ferdinand Lutschounig

Rainer Frauwallner

Gernot Gmundner

Michael Polic

Gerhard Maringer

Walter Pessl

Sylvicley Figueira Da Silva

Hubert Haidinger

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.

Component embedded in component carrier and having an exposed side wall

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.

Component carrier and method of manufacturing the same

A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

Metal body formed on a component carrier by additive manufacturing

A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.

A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.

Component carrier having a three dimensionally printed wiring structure

A component carrier with a double layer structure is illustrated and described. The double layer structure includes an electrically conductive patterned layer structure and a further patterned layer structure made of a two-dimensional material. The patterned layer structure and the further patterned layer structure have at least partly the same pattern. In an embodiment the component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and at least one double layer structure connected with the stack.

Component carrier comprising a double layer structure

A method of manufacturing a component carrier. The method includes forming a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and embedding a filament in the stack.

Component carrier with embedded filament

A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.

Non-uniform magnetic foil embedded in component carrier

The invention refers to a component carrier realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat-passage component, said at least one heat-passage component being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer or is embedded within at least one inner layer of the component carrier, and further comprising at least one latent-heat storage unit with a phase-change material. The phase-change material is arranged within at least one cavity and integrated within a laminated build-up of the component carrier and is directly thermoconductively coupled with the at least one heat-passage component. The invention also refers to a method for producing said component carrier.

Heat capacitive component carrier and method to produce said component carrier

A method of manufacturing a constituent for a component carrier is disclosed. The method includes providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, and subsequently, attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Flame retardant structure for component carrier

An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.

Integration of all components being necessary for transmitting/receiving electromagnetic radiation in a component carrier

A heat pipe () for cooling an electronic device, especially a component carrier (), that comprises a central section () with a cavity () filled with a heat transfer fluid (). In longitudinal direction () of the heat pipe () directly connected with the central section () are a first end section () on a first end of the central section and a second end section () on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure () with a surface length (SL, SL, SL) and a surface width (SW, SW, SW) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

Heat pipe and method to embed a heat pipe in a product

A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Highly thermally conductive dielectric structure for heat spreading in component carrier

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Component carrier comprising at least one heat pipe and method for producing said component carrier

A method and a sensor arrangement for determining a physical quantity are illustrated and described. The described method includes stimulating a capacitor device within a native component carrier; measuring a capacitance value of the capacitor device; and determining the physical quantity based on the measured capacitance value. Further described is a method for using a native component carrier as a transducer for detecting a value of a physical quantity.

Growing community of inventors

Vienna, Austria

Jonathan Silvano De Sousa