Other

Purdue Pharmaceutical Products L.p.

Heraeus Noblelight Fusion Uv Inc.

Koninklijke Philips Corporation N.v.

Fusion Uv Systems, Inc.

Heraeus Noblelight America LLC

Light Sciences Oncology Inc.

Jonathan S Dahm

Mark Paul Jongewaard

James C Chen

William Louis Barnard

David Bartholomew Shine

Geoff Campbell

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

Method and apparatus for using light emitting diodes for curing

A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.

Light delivery system

Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.

Micro-channel-cooled high heat load light emitting device

A lamp head module includes a high aspect ratio, high fill factor array of light emitting devices and a submount. The array includes multiple groups of electrically seriesed light emitting devices that are connected in electrical parallel. The submount is of monolithic construction and includes multiple L-shaped patterned circuit material layers. Each of the L-shaped patterned circuit material layers includes an arm portion and a stem portion. The arm portion functions as a light emitting device bond pad and the stem portion functions as a wire bond pad and a circuit trace. Each light emitting device of a group is affixed to a corresponding arm portion of the submount. The stem portions are located external to the array, run parallel to the length of the array and perform a primary current carrying function for current flow between adjacent light emitting devices of the group.

Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cmat a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80&#xb0; Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.

The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.

Multiple light-emitting element heat pipe assembly

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the 'p-n' junction.

Method and apparatus for using light emitting diodes

Method and apparatus for using light emitting diodes for the treatment of biological tissue

Light emitting apparatus

A laser device includes a laser rod; a radial array of diode laser pumping devices, wherein each diode laser has a solid connection to the laser rod to maximize laser energy transfer. The diode laser radial array is serially connected via coatings and/or fingers and/or spheres. Cooling of the laser rod and the diode laser radial array is accomplished via a common fluid channel outside the laser rod, wherein a cooling fluid flows past the laser rod and the diode laser radial array. Innovative methods for creating the coating embodiments are disclosed. Various flat diode laser embodiment are also disclosed.

Monolithic radial diode-pumped laser with integral micro channel cooling

A laser system capable of high speed silicon wafer dicing is disclosed. A laser with high average power, high repetition rate, ultra-short pulsewidth, and excellent beam quality is described. This is achieved by the use of high power diodes used to uniformly pump an improved Nd:YAlO.sub.3 crystal, resulting in a beam with excellent quality. In addition, a beta-barium borate (BBO) crystal, used in conjunction with drift step recovery diodes (DSRDs), forms a high speed optical switch which can be used to cavity dump the laser.

Short pulsewidth, high pulse repetition frequency laser system

A laser with high average power, high repetition rate, ultra-short pulsewidth, and excellent beam quality is described. This is achieved by the use of high power diodes used to uniformly pump an improved Nd:YAlO.sub.3 crystal, resulting in a beam with excellent quality. In addition, a beta-barium borate (BBO) crystal, used in conjunction with drift step recovery diodes (DSRDs), forms a high speed optical switch which can be used to cavity dump the laser.

Short pulsewidth high pulse repetition frequency laser

A laser welder is provided comprising a housing, an optical fiber, a wheel mounted within the housing and including a slot for receiving an article to be welded, the optical fiber mounted to and wound upon the wheel as the wheel is rotated to bring the fiber around the article, a sleeve for sealing to the article to establish a chamber surrounding the weld zone, the sleeve having a curved window for transmitting the laser light from the fiber to the weld zone, and a clip for removeably mounting the sleeve within the housing coaxial with the wheel. In another aspect, the invention provides the sealing sleeve for use in laser welding. The sleeve preferably includes a ring deformable with heat to clamp the sleeve to the article and center the article along an axis of the sleeve. In a further aspect, the invention relates to a method of welding articles.

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Key Largo, FL, United States of America

Jonathan S Dahm