Analog Devices,inc.

Jonathan Pfeifer

Javier Alejandro Salcedo

Edward Perry Jordan

Fin field-effect transistor (FinFET) thyristors for protecting high-speed communication interfaces are provided. In certain embodiments herein, high voltage tolerant FinFET thyristors are provided for handling high stress current and high RF power handling capability while providing low capacitance to allow wide bandwidth operation. Thus, the FinFET thyristors can be used to provide electrical overstress protection for ICs fabricated using FinFET technologies, while addressing tight radio frequency design window and robustness. In certain implementations, the FinFET thyristors include a first thyristor, a FinFET triggering circuitry and a second thyristor that serves to provide bidirectional blocking voltage and overstress protection. The FinFET triggering circuitry also enhances turn-on speed of the thyristor and/or reduces total on-state resistance.

FinFET thyristors with embedded transistor control for protecting high-speed communication systems

FinFET thyristors for protecting high-speed communication interfaces

The disclosed technology relates to electronics, and more particularly, to protection devices that protect circuits from transient electrical events such as electrical overstress/electrostatic discharge. A protection device includes a semiconductor substrate having formed therein at least two wells and a deep well underlying and contacting the at least two wells. The device additionally includes a first PN diode formed in one of the at least two wells and having a first heavily doped region of a first conductivity type and a first heavily doped region of a second conductivity type, and includes a second PN diode formed in one of the at least two wells and having a second heavily doped region of the first conductivity type and a second heavily doped region of the second conductivity type. The device additionally includes a first PN diode and the second PN diode are electrically shorted by an electrical shorting structure to form a first plurality of serially connected diodes having a threshold voltage. The device further includes a PNPN silicon-controlled rectifier (SCR) having a trigger voltage and comprising the first heavily doped region of the first conductivity type, the at least two wells, the deep well, and the second heavily doped region of the second conductivity type.

High speed interface protection apparatus

Provided herein are apparatus and methods for enhancing bandwidth in trench isolated integrated circuits. In certain configurations, an auxiliary trench forming floating regions between moat isolation regions can isolate parasitic sidewall capacitances of active device regions from ground or AC ground. In this manner the active device regions are merged by the auxiliary trench so as to improve circuit bandwidth and enhance circuit performance. When arranged or combined within a circuit branch, transistors within each floating moat can operate with relatively small parasitic displacement current and can have improved performance.

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Summerfield, NC, United States of America

Jonathan Pfeifer