Loctite (r&d) Limited

Henkel Ag & Company, Kgaa

Other

Henkel IP Holding Gmbh

Loctite Corporation

Jonathan P Wigham

Barry N Burns

Rainer Schoenfeld

Martin J Fitzpatrick

Ray P Tully

Ciaran B McArdle

Mark Loane

Matthew James Holloway

Mary B Ward

Olaf Lammerschop

Rory B Barnes

Rajat K Agarwal

Rachel Hersee

Emer Ward

Hubert K Schenkel

Harry J Woolfson

Eadaoin D Ledwidge

John E Cahill

Barry E Burns

Harry Woolfson

Paul Malone

Aisling Lakes

Helen M Murray

Matthew J Holloway

Rajat Agarwal

Rachel M Hersee

Two part cyanoacrylate/free radical curable adhesive systems, are provided.

Two part-cyanoacrylate/free radically curable adjesive systems

This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-cured epoxy-based adhesive compositions with improved impact resistance and good adhesion to oily metal substrates.

Epoxy compositions having improved impact resistance

The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

Adducts and curable compositions using same

The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.

The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Photocurable adhesive compositions, reaction products of which have low halide ion content

This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to about 9.0, such as less than or equal to about 7.5. The invention also relates to curable epoxy-based compositions including an epoxy compound, a thixotropy-conferring component, a latent hardener and at least one of the solid organic acids above demonstrating improved rheological properties such as yield point maintenance and viscosity maintenance over time.

Epoxy resin composition with solid organic acid

This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5. The invention also relates to curable epoxy-based compositions including an epoxy compound, a thixotropy-conferring component, a latent hardener and at least one of the solid organic acids above demonstrating improved rheological properties such as yield point maintenance and viscosity maintenance over time.

One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid

Growing community of inventors

Rathfarnham, Ireland

Jonathan P Wigham