Esec, Trading Sa

Unaxis International Trading Ltd

Jonathan Medding

Daniel Schnetzler

Martina Lustenberger

Marcel Niederhauser

Michael Mayer

The detachment of a semiconductor chip () from a foil () and picking the semiconductor chip () from the foil () takes place with the support of a chip ejector (), that has a ramp (), the surface () of which is formed concave and ends at a stripping edge () projecting from the surface () of the chip ejector (), and a support area () with grooves () arranged next to the stripping edge (). Vacuum can be applied to the grooves (). The detachment and picking of the semiconductor chip () from the foil () takes place in that the wafer table () is shifted relative to the chip ejector () in order to pull the foil () over the stripping edge () protruding from the surface () of the chip ejector (), whereby the semiconductor chip () temporarily detaches itself at least partially from the foil () and lands on the foil () above the support area (), and in that the chip gripper () picks the semiconductor chip () presented on the support area ().

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps:

Method for checking the quality of a wedge bond

A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.

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Birmensdorf, Switzerland

Jonathan Medding