Intel Corporation

Zarlink Semiconductor Limited

Primarion Corporation

Jonathan L McFarland

Kannan Raj

Suresh V Golwalkar

John M Burns

Noah Davis

Kevin J Cote

Wuchun Chou

Phil McClay

Steve W Greathouse

Sampath K V Karikalan

Wu Chun Chou

Eric Gelvin

A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a&#x2014;light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same

A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

Optical and electrical interconnect

An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Apparatus and method of packaging two dimensional photonic array devices

A device for forming an optical connection between an optoelectronic device and an optical fiber, forming an electrical connection between the optoelectronic device and an integrated circuit, and a forming an electrical connection between the microelectronic device and a substrate, a system including the device, and a method of forming the device and system are disclosed. The device for forming an optical connection includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector portion of a fiber ribbon cable assembly, such that when the fiber ribbon connector is attached to the device, the transmission medium provides an optical path between the optoelectronic device and the fiber.

Apparatus for coupling an optoelectronic device to a fiber optic cable and a microelectronic device, a system including the apparatus, and a method of forming the same

An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

An apparatus and method for collecting compounds from a mold press is described herein. A paper substrate is loaded into a mold press in the same manner as a conventional substrate to collect compounds during set-up, cleaning and/or conditioning cycles. The used paper substrate with the cured compound is then discarded after use. Use of a paper substrate provides significant cost savings over the currently used metal-based substrate.

Growing community of inventors

Tempe, AZ, United States of America

Jonathan L McFarland