Semiconductor Components Industries, LLC

Jonathan Harper

Vaclav Valenta

Stanley Benczkowski

YunPeng Xiao

Thierry Bordignon

Wai Lun Chu

Klaus Neumaier

James Joseph Victory

Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.

Systems and methods for designing a module semiconductor product

Growing community of inventors

Munich, Germany

Jonathan Harper