Lexmark International, Inc.

Jonathan H Laurer

Johnny Dale Massie, Ii

David Christopher Graham

David T Shadwick

Rich Wells

Gary Anthony Holt, Jr

Kin-Ming Kwan

Audrey Dale Rodgers

Sean Terrance Weaver

Paul Timothy Spivey

Melissa Marie Waldeck

Eric Spencer Hall

Mary Claire Smoot

Sean Terrence Weaver

Jeanne M Saldanha Singh

Richard Leo Hubert, Ii

Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25&#xb0; C.).

Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads

Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25&#xb0; C.).

Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto

A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Progressive stencil printing

Methods for measuring laser light transmissivity of a specific position in a work piece prior to the work piece undergoing laser welding at the specific position with a laser beam having a specific welding wavelength. To obtain a baseline measurement reading, a laser light source projects a laser beam at the welding wavelength directly into a detector. Thereafter, the work piece becomes suspended between the laser light source and detector whereby an output of the detector now corresponds to a work piece measurement reading. Differences between the two readings reveal whether the work piece will yield a satisfactory weld at the specific position when later welded by a laser beam at the welding wavelength. Preferred work pieces include inkjet printhead lids and bodies.

Measuring laser light transmissivity in a to-be-welded region of a work piece

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Lexington, KY, United States of America

Jonathan H Laurer