Delta Design, Inc.

Nikola Labs

Biopath Automation, LLC

Jonathan Eric Turner

Thomas P Jones

Mark F Malinoski

James E Dvorsky

Ryan Somogye

Roland Kyle Tallos

Brian Annis

Brock Joseph DeLong

Warren P Williamson, Iv

Thomas J Ward

Matthew J Huddleston

Kenneth E Hughes

George A Keller

Cecil R Robinson

Douglas P Allen

Dominic P DiNovo

Jean Luc Pelissier

Rebeccah P Quam

Keith A Kuisick

Ernest D VanHoose

Systems and methods can include a transponder configured to communicate wirelessly with a receiver and sensor module (RSM), wireless communicate with a high-speed network, and radio-frequency (RF) powering of RSM. The high-speed network can include a wired network such as USB or Ethernet, or wireless network such as a WiFi or cellular network. Additionally or alternatively, an antenna module can be configured to transmit radio-frequency (RF) power to a receiver configured to monitor a condition of a machine.

Systems and methods for machine condition monitoring

An automated machine for handling and embedding tissue samples contained on microtome sectionable supports. The machine includes an input member configured to hold a plurality of the microtome sectionable supports prior to a tissue embedding operation. An output member is configured to hold a plurality of the microtome sectionable supports after the tissue embedding operation. A cooling unit is configured to hold at least one of the microtome sectionable supports during the tissue embedding operation. A motorized carrier assembly is mounted for movement and configured to hold at least one of the microtome sectionable supports. The carrier assembly moves the support from the input member to the cooling unit and, finally, to the output member. A dispensing device dispenses an embedding material onto the microtome sectionable support and at least one tissue sample carried by the microtome sectionable support during the embedding operation.

Apparatus and methods for automated handling and embedding of tissue samples

An active temperature control system for a DUT utilizes a heat sink containing HFE7100 liquid and an electric heater. The liquid is cooled below the set point and the heater is used to bring the DUT up to the set point. Set points in the range of &#x2212;10 degrees C. to +110 degrees C. can be achieved. The heat sink utilizes only a single coolant for all of the set points, allowing set points to be changed within a few minutes. At a given set point, the heater provides a quick response to offset the effect of self-heating and keep the set point deviation to within a few degrees C. Power following techniques can be utilized to achieve the quick response.

Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices

A system and method for controlling a temperature of a device during testing with a thermal controller and a heat exchanger includes measuring an instantaneous power consumption of the device during testing. The heat exchanger is controlled with the thermal controller using the measured instantaneous power consumption by the device to regulate the temperature of the device during testing, wherein the heat exchanger is in conductive contact with the device.

Temperature control of electronic devices using power following feedback

The power of a device under test (DUT) is monitored without reliance on dedicated current and voltage monitoring signals available from a semiconductor test unit. One or more magneto-resistive current sensors are provided external to, and in between the DUT and a power source. The current sensor(s) provide a detection signal proportional to the current drawn by the device from the power source. A monitoring circuit multiplies the detected current by the core voltage supply to the DUT to obtain a signal representative of the power of the device. The power signal is provided to a control circuit that operates a heat exchanger, such as on active conductive heat exchanger, to adjust the temperature of the device based on the signal representative of the power of the device. In this way the temperature of the DUT can be maintained at or near a constant set point.

Active power monitoring using externally located current sensors

A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.

A method for controlling a device temperature measures a parameter related to device power consumption and utilizes the parameter to control the device temperature. This can be achieved with a system including a heat exchanger, a power monitor, and a circuit which controls the temperature setting of the heat exchanger. The circuit uses as inputs the power level, heat exchanger temperature, and set point. The system thus eliminates the need for temperature sensing devices in or connected to a chip, responds to the temperature of the device and not the package, can be used for high volume chip manufacturing, does not require significant surface area of a device for temperature sensing, and eliminates the need for chip power profiles. Significantly, the system allows a set point to be maintained with minimal overshoot or undershoot.

A method for controlling the temperature of a DUT during a testing operation, includes a) measuring a parameter related to power consumption by the DUT during testing, such as current consumption; and b) using the parameter related to power consumption to operate a temperature control device to compensate for temperature change due to changes in power consumption by the DUT during testing. The control can be closed loop or open loop with control signals incorporated into a test program. Apparatus for controlling the temperature of a DUT during testing, includes a) a device for measuring a parameter related to power consumption by the DUT during testing; b) a temperature control device which operates to control the temperature of the DUT during test; and c) a device for controlling operation of the temperature control device according to the measured parameter related to power consumption.

Method and apparatus for temperature control of a device during testing

An active temperature control system for a DUT utilizes a heat sink containing HFE7100 liquid and an electric heater. The liquid is cooled below the set point and the heater is used to bring the DUT up to the set point. Set points in the range of &minus;10 degrees C. to &plus;110 degrees C. can be achieved. The heat sink utilizes only a single coolant for all of the set points, allowing set points to be changed within a few minutes. At a given set point, the heater provides a quick response to offset the effect of self-heating and keep the set point deviation to within a few degrees C. Power following techniques can be utilized to achieve the quick response.

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Lewis Center, OH, United States of America

Jonathan Eric Turner