Applied Materials, Inc.

Varian Semiconductor Equipment Associates, Inc.

Jonathan David Fischer

Steven M Anella

Julian G Blake

Qin Chen

Michael W Osborne

Jeffrey E Krampert

Ernest Everett Allen

Stacia L Marcelynas

Manohara Kumar

Riordan Cayabyab

An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to a front side of the substrate, opposite the back side of the substrate.

System apparatus and method for enhancing electrical clamping of substrates using photo-illumination

An insulating system to reduce or eliminate the possibility of arcing while the pressure within a chamber is being varied is disclosed. The system is operable at cryogenic temperatures, such that the insulating system is able to accommodate dimensional changes due to thermal contraction. The insulating system, which includes a housing having one or more bores, is disposed between the two components which are to be electrically connected. An electrical contact, which may be spring loaded, passes through the bore and is used to electrically connect the two components. The ends of the electrical contact are surrounded by an insulating extender which extends from the housing. In one embodiment, a spring-loaded piston is used as the insulating extender. This insulating extender compensates for changes in dimension due to thermal contraction and covers the portion of the electrical contact that extends beyond the outer surface of the housing.

System for isolating electrodes at cryogenic temperatures

An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy, equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to the back side of the substrate.

A method may include providing a substrate on a clamp, and directing radiation from an illumination source to the substrate when the substrate is disposed on the clamp during substrate processing, wherein the radiation is characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.

A system that reduces the amount of water that enters a process chamber via a movable shaft is disclosed. The surface of the shaft is made hydrophobic. Any water droplets that are collected on the hydrophobic shaft are disposed at a high contact angle, making it more likely that these water droplets fall from the shaft. Further, any water that enters the process chamber is more readily removed from the shaft due to the lower energy of liberation. Reducing the amount of water in a process chamber may improve the lifetime of the components in the process chamber and may improve the yield of the workpieces being processed. This may be especially relevant when process gasses that contain halogens are employed.

Hydrophobic shafts for use in process chambers

A lift pin system and a lift pin assembly are disclosed. In one or more approaches, a lift pin system includes a wafer support, such as an electrostatic chuck or a platen, and a lift pin assembly coupled to the wafer support. The lift pin assembly may include a plurality of pins. Each of the plurality of pins may include a tip extending through a housing, a spring within the housing, wherein the spring biases against the tip, and a support arm coupled to the housing. In some approaches, the housing is threadably coupled with the support arm to allow access to the tip of each pin above a top surface of the wafer support for easy replacement. The replaceable pin tips further permit easier customization of pin tip geometries, materials, spring force, etc., depending on specific process and/or wafer characteristics.

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Lynn, MA, United States of America

Jonathan David Fischer