Rohm & Haas Electronic Materials LLC

Jonathan D Prange

Michael K Gallagher

Joseph F Lachowski

Alejo M Lifschitz Arribio

Luis A Gomez

Alexander Zielinski

Wan Zhang-Beglinger

Yi Qin

Margit Clauss

Julia Woertink

Adolphe Foyet

Pedro O Lopez Montesinos

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Method of enhancing copper electroplating

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Electroplating baths of silver and tin alloys

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Lincoln, MA, United States of America

Jonathan D Prange