Flir Systems, Incorporated

Attollo Engineering, LLC

Aerius Photonics LLC

University of California

Aspire Precision Instruments, LLC

Jonathan Charles Geske

Michael MacDougal

Andrew D Hood

Chad Wang

John E Bowers

Elliot Burke

R Jacob Baker

Lloyd Frederick Linder

Daniel Renner

Chad Shin-deh Wang

A PIN photodetector includes an n-type semiconductor layer, an n-type semiconductor cap layer, a first plurality of p-type regions located within the n-type semiconductor cap layer and separated from one another by a distance d, and an absorber layer located between the n-type semiconductor layer and the n-type semiconductor cap layer including the first plurality of p-type regions. The plurality of p-type regions are electrically connected to one another to provide an electrical response to light incident to the PIN photodetector.

PIN photodetector

A device and method for an amplitude modulated optical pickup for a stringed instrument are disclosed. A first optical source comprising a first output signal comprising a first carrier frequency is provided and a first photodetector is in optical communication with the first optical source. A vibrating element such as a string on a musical instrument is disposed in an optical path between the first optical source and the first photodetector whereby a vibration of the element varies and modulates an amplitude of the first output signal received by the photodetector that is proportional to an element vibration amplitude and is at the same frequency as the element vibration frequency. An amplitude modulated (AM) photodetector signal output is generated from the first photodetector. The resultant signal is then demodulated with appropriate circuitry to produce a substantially noise free electronic signal representative of the element vibration frequency.

Device and method for amplitude modulated optical pickup for a stringed instrument

A modulated light receiver includes a photo-sensitive element, an electromagnetic interference (EMI) detection circuit, and a decision-making controller. The photo-sensitive element is configured to generate an electrical signal in response to modulated light. The electromagnetic interference (EMI) detection circuit is configured to generate an electrical signal in response to EMI. The decision-making controller is electrically coupled to the photo-sensitive element and the EMI detection circuit, wherein the decision-making controller generates an output based on the inputs received from the photo-sensitive element and the EMI detection circuit.

System and method of mitigating electromagnetic interference (EMI) in modulated light detection systems

A laser illuminator/pointer can have an array of diode lasers for providing laser beams. A beam shaping optic can shape each of the laser beams. A movable, substantially transparent window can be in a path of the laser beams. A plurality of diffusers can be disposed on the window and can be positioned to vary a divergence of at least one of the laser beams when the window is moved.

Scalable laser with selectable divergence

Embodiments of the invention describe an illuminator having a light source to originate an illumination beam, wherein the light source further comprises a set of vertical-cavity surface emitting lasers (VCSELs), including a first VCSEL having a first laser emission wavelength, and a second VCSEL having a second laser emission wavelength different than the first laser emission wavelength. Thus, by varying laser emission wavelengths of VCSELs in a VCSEL array, embodiments of the invention produce low-contrast speckle, and do not limit the imaging capabilities of the host illumination system. In some embodiments of the invention, vertical external cavity surface emitting lasers (VECSELs) are utilized to produce the above described varying laser emission wavelengths.

Multi-wavelength VCSEL array to reduce speckle

Vertical Cavity Surface Emitting Laser (VCSEL) arrays with vias for electrical connection are disclosed. A Vertical Cavity Surface Emitting Laser (VCSEL) array in accordance with one or more embodiments of the present invention comprises a plurality of first mirrors, a plurality of second mirrors, a plurality of active regions, coupled between the plurality of first mirrors and the plurality of second mirrors, and a heatsink, thermally and mechanically coupled to the second mirror opposite the plurality of active regions, wherein an electrical path to at least one of the plurality of second mirrors is made through a via formed through a depth of the plurality of second mirrors, and a plurality of VCSELs in the VCSEL array are connected in series.

Serially interconnected vertical-cavity surface emitting laser arrays

A single camera capable of capturing high speed laser return pulses for a target, as well as provide imaging information on the background of the target. This capability is enabled by having a read-out integrated circuit (ROIC) capable of extracting both types of information from a pixel of a focal plane array (FPA). Further, an ROIC topology that allows for the ability to distinguish between high frequency and low frequency signal paths, and provide supporting circuitry to process the two paths separately. One path may integrate the low frequency background scene to provide a high fidelity image of the scene. The second path may process high frequency noise and multiple laser pulse returns within a frame. These two paths may be combined to provide a background image with a superimposed laser return.

Dual well read-out integrated circuit (ROIC)

An array of vertical-cavity surface emitting lasers (VCSELs) may be fabricated with very high fill-factors, thereby enabling very high output power densities during pulse, quasi-continuous wave (QCW), and continuous wave (CW) operation. This high fill-factor is achieved using asymmetrical pillars in a rectangular packing scheme as opposed prior art pillar shapes and packing schemes. The use of asymmetrical pillars maintains high efficiency operation of VCSELs by maintaining minimal current injection distance from the metal contacts to the laser active region and by maintaining efficient waste heat extraction from the VCSEL. This packing scheme for very high fill-factor VCSEL arrays is directly applicable for next generation high-power, substrate removed, VCSEL arrays.

High fill-factor efficient vertical-cavity surface emitting laser arrays

Embodiments of detectors made using lattice matched photoabsorbing layers are disclosed. A photodiode apparatus in accordance with one or more embodiments of the present invention comprises an indium phosphide substrate, and a photoabsorbing region comprising at least an indium gallium arsenide antimonide nitride (InGaAsSbN) layer, wherein the InGaAsSbN layer has a thickness of at least 100 nanometers and is nominally lattice-matched to the indium phosphide substrate.

InGaAsSbN photodiode arrays

A wavelength selectable light source is comprised of a two-dimensional (2-D) array of variable wavelength vertical-cavity surface-emitting lasers (VCSELs), wherein light beams emitted from the VCSELs are coupled into an output optical fiber. The light beams emitted from the VCSELs are collimated via a 2-D array of micro-lenses, the collimated light beams impinge upon a first fixed-position mirror that points each of the collimated light beams toward a second movable mirror located at a common focal point in a common area, and the second movable mirror redirects the collimated light beams into a lens coupled to the output optical fiber. By moving the second movable mirror, different ones of the collimated light beams can be directed into the output optical fiber, so that the second movable mirror performs a wavelength selection function.

Growing community of inventors

Ventura, CA, United States of America

Jonathan Charles Geske