Macom Technology Solutions Holdings, Inc.

Jonathan Chang

Marvin Marbell

Basim H Noori

Haedong Jang

Qianli Mu

Jeremy Fisher

Michael Lefevre

A semiconductor device package includes a plurality of input leads, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combined output lead configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal.

Output-integrated transistor device packages

A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.

Output-integrated transistor amplifier device packages incorporating internal connections

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Morgan Hill, CA, United States of America

Jonathan Chang