Xilinx, Inc.

Jonathan Chang

Gamal Refai-Ahmed

Suresh Ramalingam

Henley Liu

Nui Chong

Hong-Tsz Pan

A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the die to at least one exposed die surface.

Growing community of inventors

Mountain View, CA, United States of America

Jonathan Chang