Kollmorgen Technologies Corporation

Jonathan C Crowell

Ronald Morino

Raymond J Keogh

Brian E Swiggett

Marju L Friedrich

Andrew J Schoenberg

Robert Page Burr

George Czenczy

John T Swailes

James B Burr

George Szenczy

James C Christophersen

This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

Wire scribed circuit boards and method of manufacture

This invention relates to a method of using laser energy for bonding and stripping conductors during the scribing operation. The method provides and directs discrete laser beam pulses of substantially the same energy content at a rate which continuously varies as the conductor feed rate continuously varies to provide a constant number of discrete pulses for each incremental length of conductor being scribed.

Method for scribing conductors via laser

Method of making wires scribed circuit boards

This invention relates to an apparatus for making circuit boards in which insulated conductors are applied and bonded to a nonconductive surface to form a conductive path between contact points thereon in a predetermined precise pattern.

Apparatus for making scribed circuit boards and circuit board

Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.

Shielded interconnection boards

A method and apparatus for testing circuit boards using two or a small number of probes for making resistive and radio frequency impedance measurements e.g. capacitive measurements. The combination of resistive and impedance measurements substantially reduces the number of tests required to verify the integrity of a circuit board. The impedance or capacitive 'norm' values used in testing the circuit boards can be obtained by operating the system in a learning mode. Analysis of the data provides not only fault detection but also can indicate approximate fault location.

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Lakeville, MA, United States of America

Jonathan C Crowell