Parker-hannifin Corporation

Jonathan Bergin

Michael H Bunyan

Christopher Severance

Victoria Santa Fe

Gary Rosa

A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.

Thermally conductive foam product

A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an interior surface disposable in adhering contact with the first surface of the thermally-conductive material. The liner interior surface has one or more first zones defined thereon which exhibit a first release value relative to the first surface of the thermally-conductive material, and one or more second zones bordered by the first zones which exhibit a second release value relative to the first surface of the thermally-conductive material which is lower than the first release value of the first zones. With the second surface of the thermally-conductive material being bonded to the heat transfer surface of the thermal dissipation member, the release liner is removable from the first surface of the thermally-conductive material without substantial cohesive or adhesive failure thereof.

Growing community of inventors

Nashua, NH, United States of America

Jonathan Bergin