Fiarchild Korea Semiconductor, Ltd

Jonathan A Noquil

Seung-Yong Choi

A power module flip chip package is provided. The power module flip chip package includes a package carrier having a front surface and a back surface facing the front surface, and a power semiconductor device electrically connected to the front surface of the package carrier via conductive bumps. The conductive bumps are electrically connected to a gate terminal, a source terminal, and a drain terminal of the power semiconductor device. The power module flip chip package has reduced resistance and inductance and improved reliability.

Growing community of inventors

Bucheon-si, South Korea

Jonathan A Noquil