Apple Inc.

Jonathan A Matheson

Vinh H Diep

Frank Faqiu Liang

Reuben J Williams

Po Weng Chiu

Judith C Segura

Brian L Chuang

Kevin Z Lo

Leanne Bach Lien T Ly

Lukose Ninan

Chong Li

Daniele De Iuliis

Mahmoud R Amini

James M Jeon

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Combination parallel path heatsink and EMI shield

An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

Electronic device with integrated passive and active cooling

Connector receptacles that are arranged to avoid inadvertent connections. One example may provide contacts for a first connector receptacle that may be located behind a movable gate. The first connector receptacle may be combined with a second connector receptacle that is user accessible to save space and simplify device assembly. Combining the first connector receptacle and a second connector receptacle may also remove the movable gate from a surface of an electronic device, thereby further preventing inadvertent connections.

Gated connector receptacles

Growing community of inventors

San Jose, CA, United States of America

Jonathan A Matheson