International Business Machines Corporation

Sintef

Technische Universitaet Chemnitz

Globalfoundries Inc.

Ncc Nano, LLC

Intrinsiq Materials Limited

Jonas Zuercher

Thomas J Brunschwiler

Stefano Sergio Oggioni

Keiji Matsumoto

Gerd Schlottig

Richard J Dixon

Maaike M Visser Taklo

Timo J Tick

Bernhard Wunderle

Kerry Yu

Dominic Gschwend

Eric D Perfecto

A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Method for electrical coupling and electric coupling arrangement

An electronic circuit includes a substrate device which includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x). The first orientation (x) and the second orientation (x) are perpendicular with respect to one another.

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

A method of forming a stacked surface arrangement for semiconductor devices includes joining a first surface to a second surface with a solder bump, the solder bump including a substantially pure first metal; depositing nanoparticles of a second metal onto a surface of the solder bump; performing an annealing operation to form a film of the second metal on the surface of the solder bump; and performing a reflow or a second annealing operation to transform the solder bump from the substantially pure first metal to an alloy of the first metal and the second metal.

Silver alloying post-chip join

A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x). The first orientation (x) and the second orientation (x) are angled (&#x3b1;) with respect to one another.

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Chur, Switzerland

Jonas Zuercher