Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronics LLC

Rohm and Haas Elcetronic Materials LLC

Jonas Guebey

Wan Zhang-Beglinger

Katharina Weitershaus

Michael P Toben

Margit Clauss

Felix J Schwager

André Egli

Andreas Scheybal

Adolphe Foyet

A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

High speed method for plating palladium and palladium alloys

A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.

Chrome-free methods of etching organic polymers with mixed acid solutions

White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.

Adhesion promotion of cyanide-free white bronze

A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Method of preventing silver tarnishing

Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Growing community of inventors

Kriens, Switzerland

Jonas Guebey