Science Research Laboratory, Inc.

Science Research Laboratories, Inc.

Other

Massachusetts Institute of Technology

Cymer, Inc.

Corporation for National Research Initiatives

Jonah H Jacob

Henry M Eppich

Aland K Chin

Michael A Huff

Allen M Flusberg

Richard H Chin

William T Plummer

Alexander Bykanov

George Barbastathis

Richard C Lanza

James L Moran

Akintunde Ibitayo Akinwande

Ruth E Shefer

Robert E Klinkowstein

Rajiv Gupta

Barbara J Hughey

Joseph A Mangano

Martin A Jaspan

Rodney Alan Petr

Berthold Klaus Paul Horn

Geoffrey O Campbell

Mehmet Dogan

Wenyang Sun

Maciej Thomas Knapczyk

Israel Smilanski

Mordechai Rokni

System and method for imaging an integrated circuit (IC). The imaging system comprises an x-ray source including a plurality of spatially and temporally addressable electron sources, an x-ray detector arranged such that incident x-rays are oriented normal to an incident surface of the x-ray detector and a three-axis stage arranged between the x-ray source and the x-ray detector, the three-axis stage configured to have mounted thereon an integrated circuit through which x-rays generated by the x-ray source pass during operation of the imaging system. The imaging system further comprises at least one controller configured to move the three-axis stage during operation of the imaging system and selectively activate a subset of the electron sources during movement of the three-axis stage to acquire a set of intensity data by the x-ray detector as the three-axis stage moves along a three-dimensional trajectory.

Nanoscale X-ray tomosynthesis for rapid analysis of integrated circuit (IC) dies

Methods and systems for reducing SWaP in combinations of laser diode drivers (LDDs) and diode laser pump modules (DPMs) are disclosed.

Methods and systems for reducing size weight and power (SWaP) in high energy laser systems

Methods to minimize electro-corrosion in the water cooling ports of stacked heat sinks (coolers) and components fabricated according to those methods are disclosed.

Methods for protecting cooling ports from electro-corrosion in stacked coolers and articles made using the methods

Methods and systems for increased heat removal from devices in which the component design allows for thinner heat removal components.

Methods and systems for heat flux heat removal

A method and apparatus transferring high radiant power from a plurality of laser diodes into a single optical fiber with high efficiency, small size, and reduced weight.

Method and apparatus for compact and efficient introduction of high radiant power into an optical fiber

A method, and systems to implement the method, for reducing slow axis divergence in a laser diode bar including tailoring a power deposition profile across the emitter so as to reduce thermal gradients, thereby resulting in a substantially (nearly) uniform temperature across the width of the emitter.

Methods and systems for reducing slow axis divergence in laser diodes

Embodiments of micro-x-ray sources and methods for obtaining a micro-x-ray source are disclosed.

Systems and methods for accelerating charged particle beams

A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.

Means for improved implementation of laser diodes and laser diode arrays

A method of attaching a semiconductor component to a heat-sink where the component is first placed onto a heat-sink substrate whose attachment surface comprises a malleable-metal film, a semiconductor component is placed onto the malleable-metal film, and pressure and heat is applied for a predetermined time to the stack including substrate with malleable-metal film and semiconductor component.

Method for bonding of semiconductor component to a substrate

Methods and systems for semiconductor diode junction protection.

Methods and systems for semiconductor diode junction protection

Methods and systems that enable the combining of laser diodes into a laser beam.

Methods and systems for laser diode control

Screening methods and systems that can detect semiconductor junction devices that may exhibit sudden failure.

Methods and systems for semiconductor diode junction screening and lifetime estimation

Protection methods and protection systems for semiconductor devices with diode junctions.

Growing community of inventors

Brookline, MA, United States of America

Jonah H Jacob