Thermal Corporation

Advanced Cooling Technologies, Inc.

Other

Jon Zuo

Donald M Ernst

Scott D Garner

David Bruce Sarraf

Peter M Dussinger

Daniel T Reist

William G Anderson

G Yale Eastman

Dmitry K Khrustalev

Ernest H Dubble

A L Phillips

L Ronald Hoover

A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.

Double sided heat exchanger cooling unit

A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.

A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.

Modular heat sink

The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Semiconductor package with lid heat spreader

The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump that supplies liquid from the reservoir to the evaporator and the second loop also returns excess liquid not vaporized to the reservoir. An optional reservoir cooler can be used to assure that the reservoir temperature and vapor pressure are always lower that the temperatures and pressures of the evaporator and condenser.

Hybrid capillary cooling apparatus

A heat transfer loop system includes a primary passive two-phase flow segment with an evaporator, a condenser and a liquid reservoir, and a secondary actively pumped liquid flow segment in which the liquid in the reservoir is drawn by a liquid pump into the evaporator, where a portion of the liquid is vaporized by the heat input and moves into the primary segment while the excess liquid is pumped back to the reservoir. The evaporator consists of a porous wick and one or more liquid arteries encased in the porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The excess liquid continues to move through the arteries and eventually out of the evaporator and into the reservoir. The porous wick provides sufficient capillary force to separate the liquid inside the arteries and the vapor in the evaporator.

Hybrid loop cooling of high powered devices

A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.

Heat pipe having a wick structure containing phase change materials

A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.

Heat spreader with oscillating flow

Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.

Method of making electronics package with specific areas having low coefficient of thermal expansion

A semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.

Electronics package with specific areas having low coefficient of thermal expansion

A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube. The condenser has a vaporous-working fluid entrance port disposed in flow communication with the vaporous-working fluid exit port of the evaporator and a liquid-working fluid exit port disposed in flow communication with the liquid-working fluid entrance port of the evaporator so that a working fluid cycles; (i) through the two spaced-apart parallel evaporators, and (ii) between the condenser and the two tubes.

Thermal bus for cabinets housing high power electronics equipment

A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.

Semiconductor package with internal heat spreader

A heat-exchanger is provided that comprises a fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs defining spaced fin walls having peripheral end edges wherein each of the fin walls has a thickness of about 0.020 inches of its length. The heat-exchanger may include at least one air-barrier plate fastened to the flat ridges on a first side of the fin core and a liquid-barrier plate fastened to the flat ridges on a second side of the fin core. A pair of end caps are sealingly fastened to and cover the peripheral end edges of the fin core so as to form a plurality of input and exit openings that communicate with the troughs. The fin wall thickness of about 0.002 inches to about 0.020 inches of its length is such that polymer materials may be selected from the group consisting of polyhalo-olefins, polyamides, polyolefins, poly-styrenes, polyvinyls, poly-acrylates, polymethacrylates, polypropylene, polyesters, polystyrenes, polydienes, polyoxides, polyamides and polysulfides, for use in forming the fin core.

Growing community of inventors

Lancaster, PA, United States of America

Jon Zuo