Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Investments, Inc.

Jon W Brunner

Gil Perlberg

Thomas J Colosimo, Jr

Horst Clauberg

James E Eder

Aashish Shah

John Shuhart

Arie Bahalul

Dan Mironescu

Moshe Amsalem

Wei Qin

Hui Xu

Gary W Schulze

Jeong Ho Yang

A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.

Methods of installing wire bonding tools on wire bonding systems, and related installation tools and systems

A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.

Methods of calibrating an ultrasonic characteristic on a wire bonding system

A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

Methods of forming wire interconnect structures

A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.

Methods of adjusting ultrasonic bonding energy on wire bonding machines

An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Electronic flame-off electrode with ball-shaped tip

A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Low-profile capillary for wire bonding

A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.

Capillary with contained inner chamfer

An improved fine pitch bonding tool for use in automatic gold ball bonders for bonding fine gold wires onto closely spaced pads on semiconductors comprises a cylindrical body portion which fits into an ultrasonic transducer and is provided with a bottle-neck working tip on the other end of the body portion for bonding fine gold wires. The working tip is provided with a wire hole diameter less than 1.4 times the diameter of the fine wire to be bonded and is further provided with a chamfer diameter on the working tip which is less than 2.5 mils across. The total tip diameter on the working tip is less than 6 mils and the working face which comprises an annular ring between the chamfer diameter and the tip diameter is provided with a face angle of approximately 22 degrees plus or minus 3 degrees. Even though the bonding tool has a smaller area working face, it has been found to produce second bonds whose pull strength is equal to prior art capillary bonding tools having larger tip diameters and working faces.

Growing community of inventors

Sellersville, PA, United States of America

Jon W Brunner