Intel Corporation

Jon Sern Lim

Min Suet Lim

Eng Huat Goh

Tin Poay Chuah

Chee How Lim

Yew San Lim

Khai Ern See

An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

Growing community of inventors

Jelutong, Malaysia

Jon Sern Lim