Qualcomm Incorporated

Qualcomm Mems Technologies, Inc.

Jon Lasiter

Ravindra Vaman Shenoy

Donald William Kidwell, Jr

Mohammad Ali Tassoudji

Kwan-Yu Lai

Mario Francisco Velez

Russell Wayne Gruhlke

Jeremy Darren Dunworth

Seong Heon Jeong

Khurshid Syed Alam

Kebin Li

Evgeni Petrovich Gousev

Jitae Kim

Hrishikesh Vijaykumar Panchawagh

Suryaprakash Ganti

David William Burns

Ravishankar Sivalingam

Jonghae Kim

Changhan Hobie Yun

Daeik Daniel Kim

Chengjie Zuo

Kostadin Dimitrov Djordjev

Vladimir Aparin

Hao-Yen Tang

Yipeng Lu

Nai-Kuei Kuo

Donald William Kidwell

Edwin Chongwoo Park

Todor Georgiev Georgiev

Vidhya Ramachandran

Omar James Bchir

Chin-Kwan Kim

Philip Jason Stephanou

Timothy Dickinson

Yu-Chin Ou

Mete Erturk

Alireza Mohammadian

Jonathan Charles Griffiths

Firas Sammoura

James Thomas Doyle

Urmi Ray

Ana Rangelova Londergan

Wen-Yu Sun

Zheng-wu Li

Victor Louis Arockiaraj Pushparaj

Donald William Kidwell Jr

Donald William Kidwell Jhr

An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.

Sensor with multiple focal zones

An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.

Dual image sensor package

Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.

Sensor module with a collar

An apparatus is disclosed for an antenna with a conductive cage. In an example aspect, the apparatus includes a ground plane with at least one opening. The apparatus also includes at least one antenna assembly with at least one radiating element, at least one feed via, and a conductive cage. The radiating element is implemented on a first plane that is substantially parallel to the ground plane. The feed via is connected to the at least one radiating element and is configured to connect to at least one transmission line through the opening. The conductive cage includes at least three ground vias, which are connected to the ground plane at positions that are distributed around the opening. Lengths of the at least three ground vias extend a portion of a distance between the ground plane and the radiating element.

Antenna assembly with a conductive cage

An antenna system includes: a ground conductor; a substrate; a pair of planar dipole conductors disposed such that at least a portion of the substrate is disposed between the ground conductor and the pair of dipole conductors; a pair of energy couplers each electrically connected to a respective one of the pair of dipole conductors; and a pair of isolated lobes including electrically-conductive material. The pair of isolated lobes are electrically separate from the pair of dipole conductors and the pair of energy couplers, and disposed between the pair of dipole conductors and the ground conductor.

Broadband antenna system

In one example, an image sensor module comprises one or more covers having at least a first opening and a second opening, a first lens mounted in the first opening and having a first field of view (FOV) centered at a first axis having a first orientation, a second lens mounted in the second opening and having a second FOV centered at a second axis having a second orientation different from the first orientation, a first image sensor housed within the one or more covers and configured to detect light via the first lens, and a second image sensor housed within the one or more covers and configured to detect light via the second lens. The first image sensor and the second image sensor are configured to provide, based on the detected light, image data of a combined FOV larger than each of the first FOV and the second FOV.

Image sensor system

An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.

Antenna package and configuration for millimeter wave

Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.

Glass ceramic antenna package

Sensor module with a collar configured to be attached to a camera module for a user device

Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.

Manufacturing method for flexible PMUT array

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

High aspect ratio interconnects in air gap of antenna package

Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

Release hole plus contact via for fine pitch ultrasound transducer integration

An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.

Antenna-on-package arrangements

An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.

Piezoelectric micromechanical ultrasonic transducers and transducer arrays

An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.

Integrated piezoelectric micromechanical ultrasonic transducer pixel and array

Growing community of inventors

Stockton, CA, United States of America

Jon Lasiter