Qualcomm Incorporated

Jon James Anderson

George A. Wiley

Brian Steele

Shashank Shekhar

George Alan Wiley

Francis M Ngai

Ronald Alton

Jeffrey A Niemann

Sumit Sur

Aziz Gholmieh

Peng Wang

Unnikrishnan Vadakkanmaruveedu

Vinay Mitter

William Ronald Panton

Bohuslav Rychlik

Thomas Klingenbrunn

Hee Jun Park

Gang Xiao

Victor Adrian Chiriac

Navid Ehsan

Jorge Luis Rosales

Young Hoon Kang

Ankur Jain

Durga Prasad Malladi

Qing Li

Stephen A Molloy

Chinchuan Andrew Chiu

Mehdi Saeidi

Palkesh Jain

Richard Alan Stewart

Jing Liu

Kurt William Otte

Reza Shahidi

Zhu Ji

Shailesh Maheshwari

Ryan Donovan Wells

Todd Robert Sutton

Christopher K Chun

Bao Vinh Nguyen

Christopher Patrick

Amit Mahajan

Christopher Cooper Riddle

Srinivasan Rajagopalan

Matthias Brehler

Kenneth Robert Baker

Deepak Krishnamoorthi

Alex Kuang-Hsuan Tu

Christopher L Medrano

James Michael Artmeier

Don Le

Glenn A Salaman

Praveen Kumar Chidambaram

Amy Derbyshire

Jin Dai

Vivek Sahu

Paras S Doshi

Edward B Victor

Steven James Doerfler

Anil Vootukuru

Gary D Good

Ali Akbar Merrikh

Damion B Gastelum

Zhongping Bao

R Nicholson Gibson

Doug Gerecht

Vijay Raman

Shujuan Wang

Joshua D Thielen

Michael Kevin Spartz

Vasanth Kumar Ramkumar

Eric Ian Mikuteit

Eric Stephen Mattis

Alex Tu

Roy Benjamin Silverstein

Sorin Adrian Dobre

Kwangyoon Lee

Pradeep Sagane Gowda

Adam Cunningham

Joseph Victor Zanotelli

Vijay Balasubramanian

Dianne D Horn

Melanie Dolores Oclima

Richard Wunderlich

Daniel James Willis

Le Gao

James D Burrell

Hans Lee Yeager

Christopher L Platt

Chethan Swamynathan

Heekab Shin

Henri Begin

Liang Cheng

Siva Sandeep Dhandu

Maria G Lupetini

Bijan B Tuysserkani

Douglas A Gerecht

Zenghui Zhao

Ron F Alton

Mohammed A Tantoush

An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Systems, methods, and apparatus for passive cooling of UAVs

Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.

Systems and methods of dynamic thermal management for enhancing thermal performance in 5G enabled devices

Because the touch temperature of a wearable computing device ('WCD') may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

System and method for thermal management of a wearable computing device based on proximity to a user

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Multi-phase heat dissipating device comprising piezo structures

Various embodiments of methods and systems context-aware thermal management in a portable computing device ('PCD') are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.

System and method for context-aware thermal management and workload scheduling in a portable computing device

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

Multi-phase heat dissipating device for an electronic device

Aspects include computing devices, systems, and methods for managing a first computing device component of a computing device in order to extend an operating life of the computing device component. In an aspect, a processing device may determine a condition estimator of the first computing device component, determine whether the condition estimator of the first computing device component indicates that a condition of the first computing device component is worse than the condition of a second computing device component, and assign workloads to the first and second computing device components to balance deterioration of the condition of the first and second computing device components in response to determining that the condition estimator of the first computing device component indicates that the condition of the first computing device component is worse than the condition of the second computing device component.

Runtime optimization of multi-core system designs for increased operating life and maximized performance

Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

Enclosure cooling for thermal management of unmanned aerial vehicles

An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (&#x3c1;) and density (C) for the material, such that k*&#x3c1;*Cis between 0 (J*W)/(m*K) and 1,000,000 (J*W)/(m*K). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m, and a specific heat between 1900-2000 J/kg-K.

Skin material design to reduce touch temperature

An integrated device that includes a substrate, a device level layer formed over the substrate, and interconnect portion over the device level layer. The device level layer includes a plurality of first device level cells, each first device level cell comprising a first configuration. The device level layer includes a plurality of second device level cells. At least one second device level cell includes a second configuration that is different than the first configuration. The plurality of second device level cells is located over at least one region of the integrated device comprising at least one hotspot.

Integrated device comprising device level cells with variable sizes for heat dissipation around hotspots

A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.

Method and system for optimizing performance of a PCD while mitigating thermal generation

A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

Multi-phase heat dissipating device embedded in an electronic device

Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip ('SoC') are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ('QoS') by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Energy efficiency aware thermal management in a multi-processor system on a chip

Energy efficiency aware thermal management in a multi-processor system on a chip based on monitored processing component current draw

Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device ('PCD') are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a 'worst use case' scenario can unnecessarily limit the quality of service (&#x201c;QoS&#x201d;) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

System and method for thermal management in a multi-functional portable computing device

Growing community of inventors

Boulder, CO, United States of America

Jon James Anderson