Qualcomm Incorporated

Jon Gregory Aday

Hong Bok We

Nicholas Ian Buchan

Mario Francisco Velez

Hrishikesh Vijaykumar Panchawagh

Kostadin Dimitrov Djordjev

David William Burns

Dong Wook Kim

Jessica Liu Strohmann

Firas Sammoura

Jae Sik Lee

Chin-Jen Tseng

Leonard Eugene Fennell

Steve Joseph Bezuk

A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.

Fingerprint sensor device and methods thereof

A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

Interface substrate and method of making the same

Some implementations provide a semiconductor device (e.g., die, wafer) that includes a substrate, that is configured with trenches that are dry-etched into a surface of the substrate inside an area defined by scribe lines of the substrate. A crack stop structure is provided for the semiconductor device that includes a polymer dielectric layer coating that fills the trenches with a polymer dielectric material and provides a dielectric layer over the surface of the substrate inside the area. The polymer dielectric layer coating and trenches are configured to reduce cracking or chipping of the substrate in the area defined by scribe lines after cutting.

Polymer crack stop seal ring structure in wafer level package

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Escondido, CA, United States of America

Jon Gregory Aday