Hewlett-packard Development Company, L.P.

Advanced Energy Industries, Inc.

Jon Danielson

Adolfo Adolfo Gomez

Mark Lessman

Henry Wang

Courtney L Crandell

Alexander Klug

Steven Lawless

Michael Shover

A connection clamp assembly and an electrical system including a connection clamp assembly are disclosed. The connection clamp assembly includes a rigid clamp portion with one or more protrusions configured to mechanically secure one or more electrical leads of an electronic device to one or more electrical connection points on a printed circuit board assembly forming an electrical connection. One or more fasteners pass through the rigid clamp portion and are configured to couple the connection clamp assembly to the printed circuit board assembly. A lid elastic element is received by the rigid clamp portion and is configured to elastically press on the electronic device, mechanically and thermally coupling the electronic device to the printed circuit board assembly.

Mechanical and electrical connection clamp

In some examples, a head-mounted device (HMD) includes a display device to present an augmented reality (AR) view. The HMD receives first output information generated by a first type of quantification instrument that is to perform a first quantification of a collection of physical objects, and second output information generated by a second type of measurement instrument that is different from the first type of measurement instrument to perform a second quantification of the collection of physical objects. The HMD presents, on the display device, the first output information and the second output information in the augmented reality view of a physical environment in which the collection of physical objects being quantified objects is provided.

Augmented reality presentations of information from quantification instruments

In an example in accordance with the present disclosure, an extended reality system is described. The extended reality system includes an imaging system to present virtual objects to a user. The extended reality system also includes a machine vision tracking system. The machine vision tracking system includes a camera to capture images of a user's hand a tool grasped in the user's hand. The machine vision tracking system also includes a processor. The processor 1) tracks a position and orientation of the user's hand in physical space, 2) identifies the tool grasped in the user's hand, and 3) tracks a position and orientation of the tool in physical space. The extended reality system also includes an XR controller to manipulate the XR environment based on the position and orientation of the tool and the position and orientation of the hand.

Machine vision hand and tool tracking

In an example in accordance with the present disclosure, an input movement tracking device is described. The input movement tracking device comprises a tracking device housing and a connector to mechanically attach the tracking device housing to an input device. The input movement tracking device also includes an electrical connector to receive input from the input device to be transmitted to a host computing device. A tracking system disposed within the tracking device housing tracks a position and orientation of the tracking device housing and the input device in physical space and a transceiver disposed within the tracking device housing communicates with the host computing device.

Input device tracking systems

Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.

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Fort Collins, CO, United States of America

Jon Danielson