Hermes Microvision Inc.

Jon Chiang

Zhongwei Chen

Wei Fang

Zhonghua Dong

Yan Zhao

Chester Kuo

Steve Lin

Eric Ma

A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.

Hot spot identification, inspection, and review

Growing community of inventors

Beaverton, OR, United States of America

Jon Chiang