Honda Motor Co., Ltd.

Joji Nakashima

Shinya Watanabe

Hiroshi Otsuka

Akiji Ando

Tsukasa Aiba

Satoshi Tanimoto

Fumitomo Takano

Go Kikuchi

Kenji Taruya

Nobutaka Nakajima

Daishi Igarashi

Yusai Yoshimura

Shinnosuke Sato

A fuel cell system () in which, at the time of starting up a first fuel cell set () and a second fuel cell set (), one of a first air supply unit () or a second air supply unit () is driven and then the another air supply units is driven so that electric power of the another air supply units reaches a peak after an output voltage of the one of the fuel cell stacks reaches the first output value.

Fuel cell system and control method at time of starting-up fuel cell system

A power generation control system includes a plurality of fuel cell systems mounted in an electric device that operates using electric power, a battery mounted in the electric device, and a control device configured to control each of the plurality of fuel cell systems on the basis of states of the plurality of fuel cell systems, a state of the battery, and required power of the plurality of fuel cell systems.

Power generation control system, power generation control method, and storage medium

A fuel cell vehicle includes a fuel cell stack including a cathode flow field and an anode flow field, an atmospheric air pressure acquisition unit for obtaining pressure of atmospheric air, and a pump for sucking the atmospheric air and supplying an oxygen-containing gas to the cathode flow field through a supply channel. In the case where the temperature is predicted to be below freezing temperature after the time of stopping operation of the fuel cell stack, a scavenging period for the time of stopping operation is set based on the atmospheric air pressure, in order to perform scavenging of the cathode flow field by the oxygen-containing gas in a manner that the cathode flow field is placed in a predetermined humid state.

Fuel cell vehicle and method of setting stop time scavenging period of the vehicle

A fuel cell system includes a fuel cell stack, a gas liquid separator, a water level sensor, a drain valve, and a control unit. When a failure detection processing method is performed, a control unit makes a determination of main conditions where the water level sensor determines that water is present, a power generation current value of the fuel cell stack is not more than a predetermined current threshold value, a drain valve for discharging water in the gas liquid separator is open. Then, the control unit counts elapsed time when the main conditions are satisfied, and in the case where the main conditions are kept satisfied for the elapsed time which is larger than a time threshold value, the control unit determines that the water level sensor has a failure.

Failure detection processing method

A temperature sensor of a fuel cell system detects, as a start-up time temperature, the temperature of a fuel cell stack or the outside temperature at the time of starting operation. A memory stores a plurality of current limitation patterns. A current limiting unit selects a current limitation pattern based on the detected start-up time temperature, and limits electrical current collected from the fuel cell stack based on the selected current limitation pattern and the temperature during operation of the fuel cell stack detected by the temperature sensor. A threshold value for a period until the temperature of the fuel cell stack reaches a reference temperature is set to be smaller as the start-up time temperature at which the current limitation pattern is selected from the plurality of current limitation patterns becomes lower.

Fuel cell system and method of controlling fuel cell system

A semiconductor device is composed of a pair of semiconductor chips () arranged parallel on the same flat plane; a high voltage bus bar () bonded on the surface on the collector side of one semiconductor chip (); a low voltage bus bar () connected to the surface on the emitter side of the other semiconductor chip () with a bonding wire (); a first metal wiring board (-) connected to the surface on the emitter side of the semiconductor chip () with a bonding wire (); a second metal wiring board (-) bonded on the surface on the collector side of the semiconductor chip (); a third metal wiring board (-) connected to the first metal wiring board (-); a fourth metal wiring board (-) connected by being bent from an end portion of the second metal wiring board (-); and an output bus bar () having output terminals () extending from each end portion of the third metal wiring board (-) and that of the fourth metal wiring board (-).

Semiconductor device

A semiconductor device includes first and second assembled bodies (A,B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar () connected to one surface of the first semiconductor chip, a first metal wiring board (-) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (-) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar () connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (-) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (-) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

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Wako, Japan

Joji Nakashima