Atmel Corporation

Winbond Electronics Corporation

Johnny Chan

Philip S Ng

Jinshu Son

Tin-Wai Wong

Jeffrey Ming-Hung Tsai

Teng Su

Chi-Shun Lin

Koying Huang

Ken Kun Ye

Tinwai Wong

Tsung-Ching Wu

Alan L Renninger

Hsi-Hsien Hung

Jeff Ming-Hung Tsai

Tin Wai Wong

Douk-Hyoun Ryu

Seow-Fong Lim

Liqi Wang

James C Hughes

Jeffrey M Tsai

Dennis Cheng

Michael Chi Li

A write cycle recording device includes a storage device and a controller. The storage device is corresponding to a memory block of a non-volatile memory. The storage device has a plurality of bits for recording a plurality of recorded writing loop counts corresponding to a plurality of writing operations of the memory block. The controller is configured to: perform a writing operation on the memory block; record a performed writing loop count of the writing operation; and, update a recorded writing loop count corresponding to the writing operation in the storage device according to the performed writing loop count.

Non-volatile memory and write cycle recording device thereof

An option code providing circuit includes a plurality of resistive random access memory cells and a controller. The controller determines whether to provide a control signal to operate a heavy forming operation on the resistive random access memory cells or not. Wherein, the controller performs a read operation on the resistive random access memory cells to determine a bit number of the resistive random memory cell which is heavy formed, and the option code is determined by the bit number of resistive random access memory cell which is heavy formed or a bit number of the resistive random access memory cell which is not heavy formed.

Option code providing circuit and providing method thereof

A memory testing method for testing a memory apparatus configured with an auxiliary testing circuit is provided. The memory testing method includes: reading a test data from a memory array of the memory; and encoding the test data into an encoded data by the auxiliary testing circuit, wherein the encoded data comprises a first piece data and a second piece data. The encoded data is encoded to include a first piece data and a second piece data, where the first piece data indicates a number of a binary state in the read test data, and the second piece data indicates an error bit in the read test data. In addition, a memory apparatus for the memory testing method is also provided.

Memory testing method and memory apparatus therefor

A memory device includes a memory array including a plurality of memory cells that store data, a sense circuit coupled to the memory array for reading data stored in the memory array, a data register for storing data to be written into the memory array, a data processor, and a control unit. The data processor is configured to receive input data units to be written into the memory array, and process the input data units based on array data units stored in the memory array to generate processed data units. The control unit is configured to write the processed data units into the memory array.

Memory device including data processor and program method of same

A memory device includes a memory cell array and a control unit. The memory cell array includes a plurality of memory cells arranged in rows and columns, a plurality of word lines extending in a row direction and coupled to respective rows of the memory cells, and a plurality of local bit lines extending in a column direction and coupled to respective columns of the memory cells. The control unit is configured to program a selected one of the rows of memory cells to have a predetermined pattern of digital states, couple selected ones of the local bit lines to a global bit line and couple unselected ones of the local bit lines to ground based on the predetermined pattern, apply a stress voltage to the global bit line, and after a predetermined period of time, sense the digital states of the selected row of memory cells.

Memory device and stress testing method of same

The invention provides a resistive memory apparatus including at least one first resistive memory cell, a first bit line selecting switch, a first source line selecting switch, a first pull down switch and a second pull down switch. The first bit line selecting switch is coupled between a first bit line and a sense amplifier. The first source line selecting switch is coupled between a source line and the sense amplifier. The first and second pull down switches are respectively coupled to the bit line and source line. When a reading operation is operated, on or off statuses of the first bit line selecting switch and the second pull down switch are the same, on or off statuses of the first source line selecting switch and the first pull down switch are the same, and on or off statuses of the first and second pull down switches are complementary.

Resistive random access memory apparatus with forward and reverse reading modes

The invention provides a semiconductor wafer with a die area and a scribe area, and the semiconductor wafer includes a die and a testing circuit. The die is formed on the die region of the semiconductor wafer, and the die includes a main circuit. The testing circuit is disposed on the scribe area of the semiconductor wafer, and is electrically connected to the die for testing the main circuit.

Semiconductor wafers, and testing methods thereof

Respective die IDs are determined for a plurality of memory die commonly packaged as a memory device based on their respective Unique Identifiers ('UIDs'). An external controller initiates an internal Die ID ('DID') determination process in which each die eventually asserts a signal on its inter-die signaling pin after a number of clocks as determined by its UID, and assigns itself a Die ID based on the number of signals asserted by other die prior to its own signaling response. Each die keeps track of the number of signals asserted by the other die prior to its own signaling response, as well as, optionally, the total number of signals on the signaling pin to determine the package die count for the device.

Methods of and apparatus for determining unique die identifiers for multiple memory die within a common package

A method includes steps of: providing a first memory cell array including a plurality of first word lines, wherein a plurality of first data are stored in the first memory cell array; providing a second memory cell array including a plurality of second word lines, wherein the second memory cell array is separated from the first memory cell array, and a plurality of second data are stored in the second memory cell array; selecting one of the first word lines and one of the second word lines at a same time or an overlapping time; alternately selecting a first address of the first memory cell array and a second address of the second memory cell array to alternately read a first corresponding portion of the first data and a second corresponding portion of the second data from the first memory cell array and the second memory cell array.

Memory device with interleaved high-speed reading function and method thereof

A sense amplifier has a reference cell current branch in which a reference cell determines a reference cell current, a column load converts the reference cell current to a reference voltage, and a feedback circuit to maintain the reference cell drain voltage. The sense amplifier also has a main cell current branch in which a main cell operationally selected from an array of flash memory cells determines a main cell current, a column load converts the main cell current to a main voltage, and a feedback circuit to maintain the main cell drain voltage. A differential amplifier compares the reference voltage with the main voltage and furnishes a logical level at its output depending on the relative values. A boost circuit has a pull up section coupled across the column load and a pull down section coupled across the main cell for accelerating the logical zero sensing time.

Sense amplifier for flash memory

A method of erasing a target erase area of a non-volatile memory is provided, wherein the non-volatile memory is divided into an target erase area and an unselected area, and the method includes the steps in an erase cycle of: conditioning the target erase area of the non-volatile memory, wherein the unselected area is an area, excluding the target erase area, in the non-volatile memory; erasing target cells of the target erase area, wherein the threshold of the target cells is not greater than an erase verify voltage; soft-programming the target cells, wherein the threshold of the target cells is not less than a soft program verify voltage, wherein the soft program verify voltage is less than the erase verify voltage; and refreshing a predefined portion of the unselected area, wherein the predefined portion in the erase cycle is less than the unselected area.

Method of partial refresh during erase operation

A data storage device having a non-volatile memory and a controller and a control method for the non-volatile memory are disclosed. The non-volatile memory has a plurality of blocks for data storage and each block provides a plurality of sectors. The controller allocates erase marker bits in each of the sectors to record the progress of an erase operation performed on the non-volatile memory for resumption of the erase operation when required.

Data storage device and control method for non-volatile memory

The timing of logic read operations in a Flash memory device may be improved by a pad serial output circuit which receives a pre-decoded instruction signal and pre-fetched logic data prior to the last command clock, and which performs a fast resolution of the command in the pad serial output circuit on the last clock of the command input sequence. In one illustratively implementation, instruction pre-decode and data pre-fetch may be done on the seventh clock during command input. In another illustrative implementation, a first instruction pre-decode and data pre-fetch may be done on the fourth clock during command input, and a second instruction pre-decode may be done on the seventh clock during command input. Both serial protocol interface, including dual and quad I/O SPI, and quad peripheral interface are supported.

Method and apparatus for logic read in flash memory

Some embodiments include a device having storage node and a latch circuit coupled to the storage node to latch data provided to the storage node during one of a first mode and a second mode of the device. The latch circuit includes a first transistor, a second transistor, and a third transistor coupled between a first voltage node and a second voltage node. The third transistor is configured to selectively turn on and off in the first and second modes. Other embodiments are described.

Apparatus and methods for a high-voltage latch

A programming circuit and method to apply a controlled or predetermined voltage pulse for charge transfer to or from the floating gate of a non-volatile memory cell in an incremental manner to control the overall voltage across the gate oxide. Voltage above a transfer threshold voltage, such as above a tunneling threshold voltage, is applied in a stepwise charge transfer manner to or from the floating gate up to a voltage limit that is below the thin oxide damage threshold. Controlling the overall voltage avoids oxide breakdown and enhances reliability.

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Fremont, CA, United States of America

Johnny Chan