Vishay Sprague, Inc.

Other

John Yates Cadwallader

Tibor Kormendy

Kyle E Clark

Michel J Richard

Johann Huber

Edward J Frasier

A method for forming terminations on the opposite ends of a chip component includes placing a chip component in a cavity with one end of the chip component exposed. Termination conductive material is then deposited on the exposed end of the chip component and the component is removed from the cavity and reversed. Termination material is then deposited on the other exposed end. One modification of the invention includes extending the chip components completely through holes in a plate so that the opposite ends of the chip component are exposed. The termination material is then placed on the opposite ends of the chip component.

Method of forming termination on chip components

A first mold die and a second mold die are moved together and are shaped to define a mold cavity therebetween. A capacitor pellet is positioned within the mold cavity and a plurality of projections extend inwardly to engage the capacitor pellet and hold it spaced away from the cavity side wall.

Center molded capacitor

A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.

Capacitor termination assembly

The tantalum chip capacitor of the present invention includes a anode terminal which is substantially flat. The tantalum wire which extends from the tantalum pellet through the insulating material terminates substantially flush with the insulating material, allowing the termination materials to be applied over a substantially flat surface. The tantalum chip capacitors of the present invention are created by methods which include the step of grinding the anode end of the capacitor so that the tantalum wire is flush with the insulating material. Conductive materials can then be applied to the anode end of the capacitor creating a substantially flat anode terminal.

Tantalum chip capacitor

Method for centering capacitor in mold

A first mold die and a second mold die are moved together and are shaped to define a mold cavity therebetween. A capacitor pellet is positioned within the mold cavity and a plurality of projections extend inwardly to engage the capacitor pellet and hold it spaced away from the cavity side wall. The method comprises placing the pellet body within the cavity molding and retentively engaging the pellet body with a plurality of projections to provide a space between the pellet body and the cavity side wall. A molding material is used to fill the space to provide a coating on the pellet body.

Capacitor mold and method for using same

Method for making tantalum chip capacitor

A downdraft woodburning stove in which there is improved combustion, heat transfer and combustion regulation comprising novel air inlet circulation, grate construction and automatic control of (1) temperature of exhaust gases and (2) of combustion air, and (3) the supplies of both primary and secondary air to a plurality of combustion areas.

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Kennebunk, ME, United States of America

John Yates Cadwallader