Redbox Automated Retail, LLC

Nvidia Corporation

Pdf Solutions, Incorporated

John Y Chen

Jens U Horstmann

Philip John Tomasi

William H Barber

Alva D Cravens

Jun Zhai

Abraham Fong Yee

Joseph Minacapelli

Joe Greco

Hua Fang

An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.

System with a high power chip and a low power chip having low interconnect parasitics

A system for an automated dispensing and retrieval kiosk for recorded media includes a kiosk having a plurality of vertical racks arranged in a circular formation, each vertical rack configured for storing a plurality of recorded media. A customer interface allows a customer to select or return a recorded media. A robotic element delivers the selected recorded media from the vertical racks to a media output, at the customer interface. The element also delivers a returned recorded media from a media input at the customer interface to the vertical racks. A computer controls operation of the kiosk, and an internet interface connects the kiosk to the Internet. The kiosk may communicate with a central server and/or other kiosks of a group, to locate a requested recorded media within a kiosk of the group. Once located within the group, the requested media may be reserved for customer pick-up.

System for an automated dispensing and retrieval kiosk for recorded media

A method for predicting an impact on post-repair yield resulting from manufacturing process modification is described. The method includes receiving bit data representing locations of defective memory cells for a plurality of memory devices. The bit data is modified by removing a selected failure pattern type according to a modification scheme to generate modified bit data. Repairs are simulated on hypothetical memory devices corresponding to the modified bit data, generating a result indicating whether the hypothetical memory device is good or bad. A post-repair yield is then identified and a report is generated indicating the post-repair yield, the post-repair yield representing a number of the plurality of memory devices that would be functional after repair had the plurality of memory devices been manufactured without the selected failure pattern. A method to identify a process providing the best economic benefit is also described.

Prediction of impact on post-repair yield resulting from manufacturing process modification

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Cupertino, CA, United States of America

John Y Chen