Siemens Energy, Inc.

Siemens Power Generation, Inc.

John William Wood

Gary C Stevens

James D B Smith

James D Smith

James David Blackhall Smith

Lon W Montgomery

Peter Groeppel

Thomas I Nelson

Andreas Lutz

Gary Stephens

In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrixa high thermal conductivity filler. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.

High thermal conductivity materials aligned within resins

The present invention provides for a resin mixture that comprises a highly structured resinand a less structured resin. The highly structured resinand the less structured resinare mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.

Seeding resins for enhancing the crystallinity of polymeric substructures

Polymer brushes () in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment ().

Polymer brushes

The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.

Insulation paper with high thermal conductivity materials

The present invention provides for high thermal conductivity paper that comprises a host matrix (), and high thermal conductivity materials () added to a surface of the host matrix in a specific pattern (). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

Patterning on surface with high thermal conductivity materials

In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystalpolymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids

Structured resin systems with high thermal conductivity fillers

A stator coil includes a plurality of copper strands and a layer of high thermal conductivity polymer disposed adjacent at least one of the copper strands. The high thermal conductivity polymer includes a host polymer and a high thermal conductivity filler. The high thermal conductivity polymer improves heat transfer from the plurality copper strands.

Stator coil with improved heat dissipation

The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials. The fabrics may be surface coated when they are individual fibers or strands, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.

Fabrics with high thermal conductivity coatings

A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.

Treatment of micropores in mica materials

A high thermal conductivity resin that is made up of a host resin matrix () and high thermal conductivity fillers () that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell () around the high thermal conductivity fillers (), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells () is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.

Nano and meso shell-core control of physical properties and performance of electrically insulating composites

An electrical insulation paper that is made of mica flakelets (), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.

Multi-layered platelet structure

The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materialsand a host resin matrix. The HTC materialsform a continuous organic-inorganic composite with the host resin matrixvia surface functional groups that are grafted to the HTC materialsand form covalent linkages with the host resin matrix. Phononstend to pass along the HTC materialsas they travel through the host resin matrix, and phononspass to the next HTC material if the distance between these materials is less than n.

High thermal conductivity materials with grafted surface functional groups

In one embodiment of the present invention as used for impregnating a composite tape () with HTC particles provides for permeating a fabric layer () of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer () bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.

Growing community of inventors

Winter Springs, FL, United States of America

John William Wood