Hewlett-packard Development Company, L.p.

John William Pennington, Jr

Glenn A Wong

Daniel Young Yoon

Kevin L Massaro

Siddhartha Bhat

Henry Ken Chu

Insun Hong

Ivy Tseng

Marcus Hoggarth, Jr

Peter K Lee

John Joseph Briden

Kenneth Chan

Rahul Shrikant Patil

Stephen Philip De Saulles

Joshua Glenn Little

Rahul Patil

Saro Nalbandian

Jean G Atallah

Benjamin Carroll

Carl J Ledbetter

Stacy L Wolff

Marcus A Hoggarth

Jacques L Gagne

David Henry Wykes

David N Skinner

Jack Godfrey Wood

Fletcher Liverance

John P McCarthy

Donald Gonzalez

Ken G Robertson

Ben Henley

Fu-Yi Chen

ShuChun Hsiao

Bruce Eisenhauer

Hare Lee

Nick Oakley

Joshua Marsuka

Michael Brown

Will Macia

The present disclosure provides a portable electronic device including a frame body supporting electronic components and a stand mechanism. The stand mechanism includes a foot, and an activator. The foot includes a foot support and a foot shaft including a foot guide path. The activator includes an engaging element, and the engaging element is received by the foot guide path. A portion of the foot guide path extends at an angle relative to a longitudinal axis of the foot shaft. When the activator engages a surface, the engaging element of the activator moves along the portion of the foot guide path at the angle relative to the longitudinal axis of the foot shaft causing the foot support to rotate from a stored position to a deployed position.

Self-deploying stand foot

Keyboard including a touchpad

Headset

An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

Growing community of inventors

Palo Alto, CA, United States of America

John William Pennington, Jr