Aehr Test Systems, Inc.

Verigy (singapore) Pte. Ltd.

Adv Antest Corporation

Agilent Technologies, Inc.

Advantest (singapore) Pte Ltd

Verigy Pte. Ltd.

Verigy Ipco

John William Andberg

Donald Paul Richmond, Ii

Mark Charles Carbone

Frank Otto Uher

Romi Mayder

Sanjeev Grover

Ira Leventhal

Erik H Volkerink

Lakshmikanth Namburi

Koei Nishiura

Yohannes Desta

Jerzy Lobacz

Noriyuki Sugihara

Matthew W Losey

Donald W Chiu

Paul Bonomo

Brent Thordarson

Don Chiu

Stephen Jerry Chaikin

Pam Stellmacher

Vincent E Lopopolo

Edmundo Dela Puente

Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment. Embodiments offer the ability to maintain the working fluid at a constant temperature.

Integrated cooling system for electronics testing apparatus

Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel 'split-cartridge' design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A 'probe-card stops' design may be used within the cartridge to simplify the overall cartridge design and operation.

Method and apparatus for massively parallel multi-wafer test

A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.

Stiffener plate for a probecard and method

In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.

Test electronics to device under test interfaces, and methods and apparatus using same

Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.

Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array

A probe card with an air channel over the active components for cooling the active components on the probe card is provided.

Forced air cooling of components on a probecard

A cartridge () includes a chuck plate () for receiving a wafer () and a probe plate () for establishing electrical contact with the wafer. In use, a mechanical connecting device () locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card () that is movably mounted to the probe plate by means of a plurality of leaf springs (.) The mechanical connecting device is preferably a kinematic coupling including a male connector () and first and second opposed jaws (.) Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force that pulls the chuck and probe plates together when the mechanical connecting device is engaged. To load a wafer into the cartridge, the wafer is placed on the chuck plate, the probe plate is aligned with the wafer, and the chuck plate and the probe plate are locked together. The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probe actuation force.

Wafer burn-in and text employing detachable cartridge

A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.

Liquid cooled DUT card interface for wafer sort probing

A paddle board probe card for connecting a device under test with an ATE tester by means of ZIF connectors is presented. The paddle board probe card may include more than one printed circuit board mounted on a probe card in such a manner that the more than one printed circuit boards mate with ZIF connectors on an ATE testhead interface.

Method and apparatus for a paddle board probe card

In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component disposed adjacent the top surface of the PCB, having a base portion with a plurality of legs extending therefrom; and at least one mechanism to generate a clamping force between the at least one wiffle tree and the top surface of the PCB, and between the bottom surface of the PCB and the heat sink. There is disclosed a method of attaching a printed circuit board (PCB) to a heat sink. In an embodiment, the method includes providing at least one wiffle tree component; disposing one of the at least one wiffle tree component adjacent to the PCB; and securing the one of the at least one wiffle tree component with a fastener. Other embodiments are also disclosed.

Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink

A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the printed circuit board in contact with the waterblock cooling device and the clamp plate. A method is disclosed for connecting together a heat sink assembly and a component, the method comprising inserting standoffs of a clamp plate through passage holes in a printed circuit board; inserting the standoffs of the clamp plate through clearance holes in a waterblock cooling device; and positioning a spring component in contact with the clamp plate and the waterblock cooling device so as to position the printed circuit board in contact with the waterblock cooling device and the printed circuit board in contact with the clamp plate.

Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly

In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.

Zero insertion force printed circuit assembly connector system and method

Wafer burn-in and test employing detachable cartridge

An elongated sensor is provided for detecting the presence of a liquid in an electronics system. The sensor includes an elongated sensor element having a pair of adjacent electrical conductors, and a liquid permeable material that when dry electrically insulates the conductors, and when wet with a liquid at any point along the length of the conductors allows electric coupling of the conductors. The sensor also includes a detector operable to detect the presence of the liquid by sensing the electrical coupling of the conductors.

Device, method, and system for detecting the presence of liquid in proximity to electronic components

A cartridge ( ) includes a chuck plate ( ) for receiving a wafer ( ) and a probe plate ( ) for establishing electrical contact with the wafer. In use, a mechanical connecting device ( ) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card ( ) that is movably mounted to the probe plate by means of a plurality of leaf springs ( ). The mechanical connecting device is preferably a kinematic coupling including a male connector ( ) and first and second opposed jaws ( ). The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probing force.

Growing community of inventors

Santa Cruz, CA, United States of America

John William Andberg