Optical Communication Products, Inc.

Other

Cielo Communications, Inc.

John Wasserbauer

Jeffrey Winfield Scott

Stewart A Feld

Andrew William Jackson

Ryan Likeke Naone

Leo M F Chirovsky

A method and apparatus for burning in a semiconductor wafer having a plurality of active devices utilizes temporary conductive interconnect layers to separately couple at least a portion of the anodes of the active devices together as well as at least a portion of the cathodes of the devices together. A simplified probed pad, having a reduced number of contacts may then be utilized to apply a substantially constant voltage or current to the devices. The temporary conductive interconnect layer may be patterned to include device level resistors or array level resistors that may be used to mitigate the effects of short circuits or open circuits on the processing of the devices.

Method and apparatus for performing whole wafer burn-in

A folded cavity semiconductor optical amplifier is provided that includes a first mirror disposed on a substrate of semiconductor material and an active region formed thereon consisting of an optical cavity with a gain medium. The optical cavity being disposed adjacent the first mirror. A second mirror is formed and disposed on the active region on a surface opposite the first mirror. The active region of the amplifier includes input and output portions formed in one or both mirrors. The input and output portions formed from layers of reduced reflectivity relative to the first or second mirror and a longitudinal waveguide integral to the optical cavity connecting the input and output portions to allow for light to be amplified to enter at the input port, travel through the vertical cavity and longitudinal waveguide, and exit as amplified light at the output portion of the waveguide structure.

Folded cavity semiconductor optical amplifier (FCSOA)

A vertical cavity laser (VCL) including a first mirror formed adjacent a substrate, an optical cavity formed adjacent the first mirror, a second mirror formed adjacent the optical cavity, a first current and/or optical aperture formed within the cavity, within the mirror or at the surface of the mirror, and an antiguide for reducing, balancing, or reversing the index step created by the first current and/or optical aperture. The VCL may further include a second optical aperture for confining the optical mode to provide single mode operation.

Antiguide single mode vertical cavity laser

An exemplary embodiment of the present invention integrates an absorbing layer into the emitting mirror of a VCSEL to reduce the reflectivity of the emitting mirror as seen by the feedback optical wave. The absorbing layer may be made of a suitable semiconductor material, such as a GaAs layer in a laser emitting near 850 nm or highly doped p-layer, and may disposed epitaxially in a semiconductor or metamorphic mirror. Alternatively, a metal layer may be disposed in the dielectric portion of a hybrid mirror or all-dielectric mirror.

Mirror structure for reducing the effect of feedback on a VCSEL

A temperature insensitive vertical cavity laser includes an active region, having a plurality of quantum wells, formed between first and second mirrors. The gain of each of said quantum wells or groups of quantum wells operate quasi-independently at different temperatures such that stimulated emission is dominated by a different quantum well or group of quantum wells at different temperatures.

Temperature insensitive VCSEL

A surface emitting laser with spatially varying optical loss to provide single mode operation. The optical loss may be introduced with an anti-phased ohmic contacts. Current injection may be constricted to a diameter that is different than the diameter of the ohmic aperture, allowing for optimization of carrier profiles for high-speed performance. Methods for index guiding are introduced to further the reproducibility of the invention.

Single mode vertical cavity surface emitting laser

A low thermal impedance optoelectronic device includes an optical cavity adjacent a low thermal impedance DBR that provides improved heat dissipation and temperature performance. The thermal impedance of the DBR may be reduced by increasing the relative or absolute thickness of a layer of high thermal conductivity material relative to a layer of low thermal conductivity material for at least a portion of the mirror periods. The thermal impedance may also be reduced by increasing the distance between phonon scattering surfaces by increasing the thickness of the high thermal conductivity layer, the low thermal conductivity layer or both.

Low thermal impedance DBR for optoelectronic devices

A vertical cavity laser includes an optical cavity adjacent to a first mirror, the optical cavity having a semiconductor portion and a dielectric spacer layer. A dielectric DBR is deposited adjacent to the dielectric spacer layer. The interface between the semiconductor portion of the optical cavity and the dielectric spacer layer is advantageously located at or near a null in the optical standing wave intensity pattern of the vertical cavity laser to reduce the losses or scattering associated with that interface.

Hybrid vertical cavity laser with buried interface

A monolithically integrated VCSEL and photodetector, and a method of manufacturing the same, are disclosed for applications where the VCSEL and photodetector require separate operation such as duplex serial data communications applications. A first embodiment integrates a VCSEL with an MSM photodetector on a semi-insulating substrate. A second embodiment builds layers of a p-i-n photodiode on top of layers forming a VCSEL using a standard VCSEL process. The p-i-n layers are etched away in areas where VCSELs are to be formed and left where photodetectors are to be formed. The VCSELs underlying the photodetectors are inoperable, and serve to recirculate photons which are not initially absorbed back into the photodetector. The transmit and receive pairs are packaged into a single package for interface to multifiber ferrules. The distance between the devices is precisely defined photolithographically, thereby making alignment easier. In a further alternate embodiment, a FET is coupled to the p-i-n photodiode to form an integrated detector preamplifier along with the VCSEL transmitter all on the same optical reference plane.

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Erie, CO, United States of America

John Wasserbauer