Nds Corporation

John Walker

Itsik Mantin

Tony Boswell

A security chip is disclosed. The security chip includes: a substrate; an integrated circuit disposed on the substrate, the integrated circuit including circuit elements, circuit interconnect layers connecting the circuit elements together, and interlayer contacts supporting the circuit interconnect layers; a shield to at least partially shield the integrated circuit; and at least one lightwell in the shield and the integrated circuit, wherein each lightwell has a closed shape formed from parts of the circuit interconnect layers and interlayer contacts, wherein no exploitable voltage can be measured on the parts of the circuit interconnect layers and interlayer contacts, and wherein each lightwell forms a path for light to penetrate to the substrate preventing the light from reaching the circuit elements. Related apparatus and methods are also disclosed.

Security chip

A system for protecting a chip with an integrated circuit disposed on a first surface, the system including, disposed on the first surface, a first antenna, signal analyzer, chip controller and a signal generator which is operative to supply an outbound signal for transmission by the first antenna, a circuit arrangement, disposed on a second surface of the chip, including a shielding arrangement and a second antenna to receive the outbound signal, the circuit arrangement being operative to transmit a return signal from the second antenna to the first antenna, such that a breach in the shielding arrangement results in a change in, or cessation of, the return signal for detection by the signal analyzer, and a chip controller disposed on the first surface being operative to perform an action on the integrated circuit in response to the detection of the breach. Related apparatus and methods also included.

Chip attack protection

A method for adding an additional layer to an integrated circuit, the method including providing an integrated circuit having an interconnect layer, depositing, over substantially all of an exposed surface of the integrated circuit, an additional layer of material whose conductivity can be altered, and selectively altering the conductivity of a first portion of the additional layer by selective annealing, to produce a sub-circuit in the additional layer, the sub-circuit being in operative electrical communication with the integrated circuit. Related apparatus and methods are also described.

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Little Milton, United Kingdom

John Walker