Storage Technology Corporation

John W Svenkeson

John David Hamre

A method of forming a conductive device includes forming a conductive layer on a substrate; etching the conductive layer to form a plurality of conductive traces; etching the conductive layer to form at least one mask feature; and removing substrate material that is not covered by the at least one mask feature so as to form at least one mechanical alignment feature.

Method of forming alignment features for conductive devices

A conductive device includes a substrate and a plurality of conductive traces supported by the substrate. Each trace has a contact portion. Moreover, sufficient substrate material is removed from the substrate to sufficiently lessen stiffness of selected ones of the contact portions so that the selected ones of the contact portions are independently displaceable with respect to each other. A method of manufacturing such a conductive device is also provided.

Compliant contacts for conductive devices

A conductive network includes a first conductive device having multiple first signal layers. Each first signal layer has a first substrate and a plurality of first conductive traces disposed on one side of the first substrate. The network further includes a second conductive device having multiple second signal layers. Each second signal layer has a second substrate and a plurality of second conductive traces disposed on one side of the second substrate. In addition, the network includes at least one bridge layer for electrically joining together the first and second conductive devices. The at least one bridge layer has a bridge substrate and a plurality of bridge traces supported by the bridge substrate.

Multi-layer conductive device interconnection

A method of connecting a first conductive device to a second conductive device is provided. The first conductive device has a first conductive trace supported by a first substrate. The first trace has a generally planar first surface spaced away from the first substrate that defines a first edge. The second conductive device has a second conductive trace supported by a second substrate. The second trace has a generally planar second surface spaced away from the second substrate that defines a second edge. The method includes joining the first edge of the first trace with the second trace to form an area of contact such that a portion of the first surface proximate the area of contact is non-parallel with a portion of the second surface proximate the area of contact.

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John W Svenkeson