Motorola Corporation

Other

John W Stafford

Michael S Lebby

Kevin Douglas Moore

Fred V Richard

Theodore Gerard Tessier

Ronald J Nelson

David A Jandzinski

Wenbin Jiang

Thomas B Harvey, Iii

William M Beckenbaugh

Ken Cholewczynski

Donald E Ackley

Franky So

Barbara Vasquez

Dennis Brian Miller

William M Williams

William F Hoffman

Barry C Johnson

Steven C Machuga

Kenneth Cholewczynski

Kenneth Kaskoun

Mauro Walker

Lubomir Cergel

George G Grouch

Irka Zazulak

High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.

PCB with embedded optical fiber

A new and improved cargo holder for pickup trucks is disclosed which is adaptable to a pickup truck bed of any size. The cargo holder is designed to hold and maintain cargo within the bed of a pickup truck without ropes and/or ties. The cargo holder could be manufactured from aluminum, galvanized steel, or heavy gauge plastic.

Truck bed cargo holder

A semiconductor laser package including a laser chip mounted to an uppermost surface of a leadframe, and a molded structure at least partially encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and an optional photodetector. The vertical cavity surface emitting laser generating an emission along a path. The molded structure including an optical element positioned a specific distance from an emission aperture of the vertical cavity surface emitting laser. The laser chip and the optical element mounted in precise z-axis alignment from the emission aperture of the vertical cavity surface emitting laser utilizing the uppermost surface of the leadframe as a dimensional reference point.

Semiconductor laser package and method of fabrication

A smartcard (10) is formed in part by a laminate layer (77). The laminate layer (77) is made up of a plurality of dielectric layers (11,30), insulating layers (45, 50), resistive layers (55), and electrically active structures. The electrically active structures include a capacitive structure (23) which is formed from one of the dielectric layers (11) and an antennae (32) which is made from a conductive layer that is formed into a spiral pattern on the another dielectric layer (30). These layers (11,30, 45, 50, 55) are formed separately and then pressed together to form the laminate layer (77).

Smartcard and method of making

A semiconductor laser package including a mounting structure at least partially encapsulating a vertical cavity surface emitting laser and a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned and/or integrally formed with the vertical cavity surface emitting laser to receive a portion of the emission. An optical element is optionally positioned in the path, mounted on the mounting structure utilizing a snap-fit connection, a threaded or adhesive mounting. The mounting structure and optical element are fabricated to allow for proper z-axis alignment of the optical element relative to the laser emission aperture.

Semiconductor laser package with power monitoring system and optical

A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

Fluxless flip-chip bond and a method for making

An integrated electro-optical package (50) including an optically transparent substrate (10) with an array (15) of light emitting devices (LEDs) (12) thereon, cooperating to generate a complete image, thereby forming a LED display chip (14). The LEDs (12) are positioned in rows and columns and having electrical connections adjacent outer edges of the substrate (10). A molded base (30), having embedded electrical conductors (31) for cooperating with the LEDs (12) of the LED display chip (14) and further having a refractive or diffractive lens (60) formed within a central opening (35), in alignment with the array (15) of LEDs (12) of the LED display chip (14) and on a side opposite the mounting of the LED display chip (14), thereby capable of magnifying the image and producing an easily viewable virtual image. A driver substrate (55) having electrical connections for interfacing with the molded base (30). A plurality of driver circuits (57) connected to the molded base (30) and LEDs (12) through electrodes on the driver substrate (55).

Integrated electro-optical package

A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. The module has a protective covering such as a cap (62) or a sealant (64) as a moisture barrier. Thus, high integration using flexible appendages (15, 25, 35, and 45) attached to a rigid substrate (12) and singularly folded above the substrate (12) results in both a small footprint package and also a light package. A reel-to-reel flex tape (56) assembly provides pre-tested flex boards (16, 26, 36, and 46) resulting in a cost-effective manufacturable package for semiconductor components.

Three dimensional semiconductor package having flexible appendages

An integrated electro-optical package (50) including a light emitting device (LED) display chip (14), with an array (15) of light emitting devices (LEDs) (12) formed thereon and cooperating to generate a complete image. The LEDs (12) are positioned in rows and columns and connected to connection/mounting pads (22) adjacent outer edges of the chip (14). An opaque mounting substrate (30) having a central opening (35). A driver substrate (55) having mounting pads (34), bump bonded to a plurality of pads (33) and (34) on the mounting substrate (30). A plurality of driver circuits (57) connected to the LEDs (12) through terminals on the driver substrate (55). A lens (60) mounted to the mounting substrate (30) over the array (15) of LEDs (12) and on a side opposite the LED display chip (14) to magnify, or serve as one element of an optical magnifier system, the complete image and produce an easily viewable virtual image.

Integrated electro-optical package with LED display chip and substrate

An integrated electro-optical package (40) including an optically transparent substrate (10) with an array (15) of light emitting devices (LEDs) (12) formed thereon, cooperating to generate a complete image, thereby forming a LED display chip (14). The LEDs (12) are positioned in rows and columns and having electrical connections adjacent outer edges of the substrate (10). A driver board (30), having embedded electrical conductors (34), plated through-hole vias (44) and/or embedded leadframes (45) for cooperating with the LEDs (12) of the LED display chip (14) and further having a plurality of driver and control circuits (42) connected to the driver board (30) and LEDs (12). A molded carrier ring (50), electrically interfaced with the driver board (30), the LED display chip (14) and the driver and control circuits (42). A molded refractive or diffractive lens (60) positioned in alignment with the array (15) of LEDs (12) of the LED display chip (14) and on a side opposite the mounting of the LED display chip (14), thereby capable of magnifying the image and producing an easily viewable virtual image.

Integrated electro-optical package with carrier ring and method of

An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

An integrated electro-optical package including an electronic circuit mounted on a substrate, first and second groups of leads extending from the circuit through a sealing area and each lead having an end exposed in a first area, transparent conductive strips positioned in the first area and each strip contacting the exposed end of a lead in the first group, an electroluminescent medium positioned on each of the strips and defining LEDs, metallic strips positioned over the electroluminescent medium as a second electrode for each of the LEDs, each metallic strip being in contact with an exposed end of an electrical lead in the second group of leads, and a hermetic seal positioned in sealing contact with the sealing area and hermetically sealing the first area.

Integrated electro-optic package

An optoelectronic transducer includes a fiber carrier having a groove formed in a major side with an optical fiber mounted in the groove and a reflecting surface positioned adjacent one end of the groove so as to direct light in-to/out-of the optical fiber. A photonic device carrier having a photonic device fixedly mounted on a major side. Mounting pads positioned on the major sides of the carriers are affixed together so that the photonic device is optically aligned with the reflecting surface and light traveling in-to/out-of the optical fiber is directed out-of/in-to the photonic device. The carriers are formed of materials with similar thermal coefficients of expansion, such as silicon and ceramic.

Optoelectronic transducer

An integrated electro-optical package including an optically transparent substrate with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the substrate. A driver substrate having mounting pads, bump bonded to the pads on the substrate. A plurality of driver circuits connected to the light emitting devices through terminals on the driver substrate. A lens mounted to the substrate over the array of light emitting devices and on a side opposite to magnify the real image and produce an easily viewable virtual image.

A board (10) for testing an integrated circuit disposed on a semiconductor wafer. The board contains a plurality of substantially parallel signal layers (14) and power planes (16) that are supported and electrically isolated by a dielectric material (12). One or more constraint layers (18,20) are disposed in the dielectric material, and the constraint layers have a coefficient of thermal expansion of about 1-6 ppm/.degree.C. In a preferred embodiment, the dielectric material is a fluoropolymer with-a ceramic or silica filler, and the constraint layers are an iron-nickel alloy of about 30-40 percent nickel by weight. The board has thermal expansion characteristics substantially similar to silicon to ensure good contact to a silicon wafer during burn-in testing.

Growing community of inventors

Phoenix, AZ, United States of America

John W Stafford