3m Innovative Properties Company

John W McAllister

Zhong Chen

Albert I Everaerts

Jason D Clapper

David T Amos

Jingjing Ma

Vasav Sahni

Petra M Stegmaier

Jacob P Johnson

Benjamin J Bending

Pierre Reinhard Bieber

Ying Zhang

Eike H Klünker

An adhesive composition is described comprising a polyisobutylene polymer component; and up to 30 wt.-% of at least one aliphatic multifunctional component comprising at least two ethylenically unsaturated groups selected from (meth)acryl or vinyl ether. The monomer comprises a hydrocarbon moiety with greater than 12 contiguous carbon atoms. When the hydrocarbon moiety is branched, the hydrocarbon moiety comprises side chains with at least two carbon atoms. The aliphatic multifunctional component is sufficiently compatible such that crosslinked adhesive composition at a thickness of 20 microns has a haze of less than 3%. Also described are adhesive articles.

Polyisobutylene adhesive comprising multifunctional component with (meth)acryl or vinyl ether groups

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60&#xb0; C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85&#xb0; C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

Pressure-sensitive adhesive compositions for manufacturing electronic devices

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Saint Paul, MN, United States of America

John W McAllister