Bae Systems Information and Electronic Systems Integration Inc.

John W Marciniec

Kenneth R Erikson

Timothy E White

Gene A Robillard

John D Mullarkey

Robert N Graney

Richard S Holland

Paul H Rourke

Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.

High-density interconnection of temperature sensitive electronic devices

Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.

Thermal mismatch compensation technique for integrated circuit assemblies

A high density, exceptionally complex and compact ultrasound transducer array using multi-layer structures composed of active integrated circuit devices on various substrates and passive devices. Electrically conducting interconnections between substrates are implemented with micro-vias configured with conductors extending through the substrates, permitting the use of divided or different integrated circuit technologies arranged and/or isolated within different integrated circuit substrates or layers of the ultrasound transducer assembly. The various layers may be assembled with solders of respectively lower reflow temperatures, to permit testing of selected layers and circuits prior to completion.

Acoustical array with multilayer substrate integrated circuits

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Framingham, MA, United States of America

John W Marciniec