International Business Machines Corporation

John W Lewis

Perry G Hartswick

Brian Christopher Barker

Nancy T Pascoe

Raymond James Bunkofske

John Z Colt, Jr

Daniel J Poindexter

James Nicholas Pinto

Robert B McClure

George F Cunningham, Jr

Kimberley J Arnold

John Colt

A semiconductor wafer including a plurality of pits in the semiconductor wafer. The pits are arranged in an information-providing pattern and are readable after completion of processing on the wafer.

Wafer identification mark

A wafer lift assembly including an RF shunt is provided. An insulating rim is connected to a powered lift cylinder via a conductive screw. The head of the screw is recessed below a top surface of the rim. A cover is arranged over top of the rim and screw. The RF shunt is a layer of conductive material arranged between the rim and the cover.

Wafer lift assembly

An improved reactive ion plasma etching apparatus having an improved electrode, for holding the product, such as a semiconductor wafer, to be etched, provided with a plurality of apertures into which different tailored product holders are inserted so as to alter the plasma over each holder and provide more uniform etching of the product in the holder regardless of its position on the electrode.

RF Coupling techniques

Growing community of inventors

Colchester, VT, United States of America

John W Lewis