Motorola Corporation

John W Hart, Jr

Mahesh K Shah

William G McDonald

Victor J Adams

David James Dougherty

Paul L Sullivan

Daniel John Wallace, Jr

Sidney H Griest

Robert W Kamb

A semiconductor component (,) and a method for coupling a semiconductor device (,) to a substrate (,). The semiconductor component (,) includes a saddle (,) and the semiconductor device (,). The saddle (,) has a plurality of sides (,) that form a semiconductor device receiving area (,). The semiconductor device (,) is inserted into the semiconductor device receiving area (,) and secured in the semiconductor device receiving area (,) using tabs (,). The saddle (,) is coupled to the substrate (,) by fasteners (,).

Saddle bracket for solid state pressure gauge

A semiconductor component includes a leadframe (10), an electronic component (21) mounted over the leadframe (10), a packaging material (23) around the electronic component (21) and the leadframe (10) wherein the packaging material has a recess (24), another electronic component (30) in the recess (24), and a cap (32) over the recess (24) and the other electronic component (30). The other electronic component (30) is electrically coupled to the electronic component (21) through internal leads (13) and (14) of the leadframe (10). After a dam bar (15) is removed from the leadframe (10), the internal leads (13) are physically and electrically isolated from other portions of the leadframe (10) including the external leads (12) and the flag (11).

Semiconductor component and method of fabrication

A package assembly (70) for encapsulating and vertically surface mounting a semiconductor device such as an accelerometer includes a semiconductor device (40), a package (44) enclosing the semiconductor device, and a plurality of leads (16, 18) protruding from the package. The plurality of leads are formed from a common leadframe (10) and an internal portion of a first lead of the plurality of leads is offset from a common plane corresponding to the common leadframe prior to forming any of the plurality of leads. The offset lead increases the rigidity and vibration-resistance of the package assembly.

Package assembly for an electronic component

A semiconductor sensor (10) is built into a cable connector to provide rapid and reliable attachment of the semiconductor sensor (10) into a monitoring or control system. The sensor (10) is mounted in a package (11) having cable connector leads (12, 13, 14) extending through the package (11). The semiconductor sensor (10) is electrically attached to the cable connector leads (12, 13, 14). A housing (20,30) surrounds the package (11) and provides a protective shroud for the cable connector leads (12, 13, 14).

Growing community of inventors

Mesa, AZ, United States of America

John W Hart, Jr