Other

Pivotal Decisions LLC

Lucent Technologies Inc.

John W Ayres, Iii

Edward Clark Fontana

Vincent M Byrne

Marvin Ray Young

Samir Satish Sheth

Jeffrey Lloyd Cox

Steven C Stein

William David Bragg

Timothy F Conway

Susan M Ayres

Peter Earl Stokes

The disclosure relates to optical fiber transmission systems, and in particular, pertains to the transceiver cards in an optical fiber transport system. In particular the disclosure teaches an improved transceiver card architecture that allows high density, flexibility and interchangeability of functionality.

Flexible, dense line card architecture

The invention is relevant to optical fiber transmission systems, and in particular, pertains to the transceiver cards in an optical fiber transport system. In particular the invention teaches an improved transceiver card architecture that allows high density, flexibility and interchangeability of functionality.

A flexible optical circuit comprising passive or active components is provided. The flexible optical circuit includes a first optical fiber having both first and second ends, a second optical fiber having both first and second ends, a flexible substrate attached to both the first and second optical fibers where the first and second pins of the first and second optical fibers extend to at least the edge of the flexible substrate and a component coupled to the first optical fiber between the first and second ends. The component can be used passive or active. A passive component requires no electrical trace lines to activate the component and the passive component will react upon the reception of a light-wave signal. The active component will require power from the back plane before the active component can modify or affect the light-wave signal. The first and second ends of the optical fibers extend at least to the edge of the flexible optical circuit or can extend beyond the edge of the flexible substrate. The flexible optical fibers can be fixedly attached to the flexible substrate through an adhesive or the flexible optical fibers can be intermittently fixedly attached to the flexible substrate.

Flexible optical circuit apparatus and method

The present invention is directed to a mounting clip for electronic components and, more specifically, to a component retention spring clip for securing electronic components to an electronic device support such as the leg of a heat sink. In one embodiment the component retention clip is comprised of a resilient strip that has an arcuate portion and first and second ends. The resilient strip is configured to encompass an electronic component and an electronic device support adjacent to the electronic component. The arcuate portion of the component retention clip contacts a portion of the electronic component, thereby partially supporting the electronic component against the electronic device support. Located at the first end of the resilient strip is a first latch configured to cooperatively engage a corresponding second latch located at the second end and retain the electronic component on the electronic device support.

Component retention clip for a heat sink assembly

The present invention provides a receptacle configured to receive an electronics module for use with an electronics equipment chassis. In one embodiment, the receptacle has a torsion bar, to which is coupled a first planar sidewall with a boss located on an inside planar surface, the boss configured to cooperatively engage a first notch formed on a rear wall of an electronics module. The first sidewall also has a locking slot formed in its front edge lo configured to receive a first locking cam associated with the electronics module, the locking slot cooperating with the locking cam and the boss to create a longitudinal compressive force along the first planar sidewall. A second planar sidewall opposing the first planar sidewall is coupled to the torsion bar.

Zero height power unit shelf system

A faceplate for a chassis composed of a moldable material and various methods of fabricating and assembling the faceplate into a fan-cooled electronics enclosure. In one embodiment, the faceplate includes: (1) a chassis mount adapted to cooperate with a corresponding first faceplate mount on the chassis to register the faceplate with respect to the chassis, (2) a fan mount adapted to cooperate with a corresponding second faceplate mount on a fan to register the faceplate with respect to the chassis and (3) a grille proximate the fan mount, the chassis mount and the fan mount cooperating to affix the fan to the chassis when the faceplate is mounted to the chassis.

Fan-mounting faceplate for a chassis and methods of manufacture and assembly therefor

The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat sink further includes an electronic device support leg that extends generally transverse from the first side and that is configured to support a heat generating electrical component thereon. Alternative embodiments of the present invention may include a plurality of such electronic device support legs. A plurality of cooling fins are also included in the present invention, extending from the second side. Moreover, each of the plurality of cooling fins has a depth that is substantially less than the width of the heat sink, which give this unique heat sink an exceptional cooling efficiency. In particular advantageous embodiments, the depth to width ratio of the fins and spine, may range from about 1 to 5 or 1 to 10, respectively.

Growing community of inventors

Forney, TX, United States of America

John W Ayres, Iii