Lucent Technologies Inc.

Other

John V Gates, Ii

Keith Wayne Goossen

James Albert Walker

Stanley K Pau

Dennis Stanley Greywall

Jungsang Kim

Joseph Shmulovich

William Robert Holland

Gerard Edmond Henein

Alexandru Paunescu

A method of calibrating a crossconnect including a MEMS device and another optical device, each of which further include a plurality of elements, the method including determining a relationship between an applied voltage and an angle response for a number of the elements of the MEMS device, determining a function of beam position and element position for the number of the elements of the MEMS device, assembling the MEMS device and the another optical device to produce the crossconnect, applying voltages to make sample connections between the MEMS device and the another optical device based on the relationship and the function, determining a transformation for the sample connections caused by packaging the crossconnect, and redetermining the relationship and the function based on the transformation. The method may be iterated more than once to achieve a more accurate determination.

Method for calibrating a MEMS device

An article and method including an optical fiber coupled to a microstructure which is easily manufactured. The microstructure is comprised of a plurality of layers including a receptacle layer and a movable layer. The optical fiber has a high reflectivity terminal end forming the non-movable layer. The receptacle layer has an opening aligned with the movable layer for receiving the terminal end of the optical fiber. The optical fiber is inserted into the opening and the receptacle layer and fixed in relation to the microstructure, so as to form cavity between the terminal end of the fiber and the movable layer of the microstructure. The movable layer is physically adapted for moving relative to the non-movable layer under the influence of an actuating force. Additionally a method of manufacture of forming a microstructure comprising a receptacle layer having an opening therein and a movable layer, inserting a terminal end of an optical fiber into the opening, and affixing the optic fiber to the microstructure.

Optical microstructure and method of manufacture

Thermal expansion mismatch between solder and substrate can result in substrate cracking, especially in the case of brittle substrates, e.g., Si or glass. This problem can be substantially eliminated through use of a novel bonding pad structure that comprises a sacrificial layer and a confinement layer disposed on the former, with a window through the latter. The confinement layer (e.g., Ti or Cr) is selected to be substantially inert with respect to the solder (e.g, AuSn) at the soldering temperature, and the sacrificial layer (e.g., Au) is selected to interact with the solder at that temperature, such that the molten solder consumes at least some of the sacrificial material, with the interface between the molten material moving laterally underneath the confinement layer. After re-solidification of the molten material the structure effectively has a distributed interface between the resolidified material and the substrate, with attendant decrease of stress in the substrate. The novel approach has wide applicability, e.g., for soldering Si chips to a Si chip carrier, or for soldering an optical fiber to a Si/SiO.sub.2 substrate.

Method of solder bonding, and article produced by the method

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New Providence, NJ, United States of America

John V Gates, Ii