Rudolph Technologies, Inc.

Applied Precision, Inc.

Mariner Acquisition Company LLC

John Timothy Strom

Raymond Kraft

Donald B Snow

Christopher J McLaughlin

Eric Endres

Christian Kuwasaki

Carl S Brown

Rodney Doe

Ray H Kraft

Mark D Cavelero

A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.

Probe card analysis system and method

Probe mark inspection involves a recipe based on unique image characteristics or combinations of unique image characteristics. Result images are correlated with a reference created to determine which image characteristic or combination of image characteristics provides an improved contrast.

Probe mark inspection

By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.

Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis, and manufacture

A system and method allow accurate calculation of probe float through optical free-hanging and electrical planarity measurement techniques. In accordance with an examplary embodiment, probe float may be determined by acquiring a free-hanging planarity measurement, obtaining a first electrical contact planarity measurement, and calculating probe float using results of the acquiring and the obtaining operations.

System and method of measuring probe float

A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed electrical planarity measurements with fast optical planarity measurements to produce 'effectively loaded' planarity measurements.

Apparatus for obtaining planarity measurements with respect to a probe card analysis system

Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis and manufacture

An image acquisition system and method may employ a non-orthogonal optical axis. The optical axis may be established in such a manner as to position a focal plane of an imaging device in a selected orientation relative to the object space. Such selective positioning and orientation of the focal plane allows the integration of two coordinate axes and enables dual-axis scanning of the object space. In some embodiments, the focal plane may extend throughout the entire depth dimension of the object space.

Dual-axis scanning system and method

A stereoscopic three-dimensional optical metrology system and method accurately measure the location of physical features on a test article in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article from two or more perspectives through a substantially transparent fiducial plate bearing a fiducial marking; camera viewing angles and apparent relative distances between a feature on a test article and one or more fiducials may enable accurate calculation of feature position.

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North Bend, WA, United States of America

John Timothy Strom