Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

John Timmerman

Sanjay Misra

Radesh Jewram

Chunyong Wu

Jeremy J Schmitz

Kasyap Seethamraju

Jeremy L Hammond

Jeremy Hammond

Jeremy Schmitz

A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silyl modified reactive polymer.

Thermal interface materials

An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Thermal interface material with mixed aspect ratio particle dispersions

An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20&#xb0; C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.

Thermally conductive EMI suppression compositions

A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.

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John Timmerman