Tyco Electronics Corporation

John Thomas Larkin, Jr

John Joseph Consoli

James Lee Fedder

Lynn Robert Sipe

Craig Warren Hornung

Alexander William Hasircoglu

Ralph Edward Spayd, Jr

A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.

Heat sink interface insert

An electrical connector is disclosed having a housing with first and second sides configured to be joined to first and second circuit boards, respectively. The electrical connector also includes a wafer held in the housing. The wafer has first and second card edges and has electrical traces extending between the first and second card edges. The first card edges are divided into upper and lower sections configured to be received in separate upper and lower connectors mounted on the first circuit board.

Electrical connector module with multiple card edge sections

Growing community of inventors

Camp Hill, PA, United States of America

John Thomas Larkin, Jr